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IC封装资料_电容_GRM1555C1H101JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121787920.26 KB29页18
IC封装资料_电容_CL10C390FB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12580259.58 KB3页31
IC封装资料_电容_CL10C361JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121454316.29 KB3页239
IC封装资料_电容_C0603NP0270JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1213481.92 MB48页237
IC封装资料_电阻_471KD14.pdf
14ΦSERIESRevision：27-Dec-151/11www.brightking.comMetalOxideVaristor(MOV)DataSheetFeatures■Wideoperatingvoltage(V1mA)rangefrom18...
2024-12-12655772.56 KB11页115
IC封装资料_电容_0805B334K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215401.05 MB27页291
IC封装资料_电容_GRM1555C1H102JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12392920.26 KB29页10
IC封装资料_电感_SWPA8040S8R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212411.32 MB22页188
IC封装资料_电容_CL10C390JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121619316.3 KB3页270
IC封装资料_电源管理芯片_LTC4065LXEDC_TRPBF.pdf
LTC4065L/LTC4065LX/LTC4065L-4.1/LTC4065LX-4.11Rev.DFormoreinformationwww.analog.comTYPICALAPPLICATIONFEATURESDESCRIPTIONStandalone...
2024-12-121383600.1 KB18页108
IC封装资料_电容_CL10C390GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121965316.18 KB3页57
IC封装资料_电容_C0603NP0470JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1215941.92 MB48页148
IC封装资料_电容_CL10A474KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A474KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128531.42 MB36页85
IC封装资料_电源管理芯片_LTC4079EDD_PBF.pdf
LTC407914079fFormoreinformationwww.linear.com/LTC4079TypicalapplicaTionFeaTuresDescripTion60V,250mALinearChargerwithLowQuiescentCu...
2024-12-121562349.21 KB20页69
IC封装资料_电阻_0603WAF100LT5E.pdf
DATASHEETProductNameThickFilmChipResistorsPartNameChipCommonSeries01005/0201/0402/0603/0805/1206/1210/1812/2010/2512UniroyalElectr...
2024-12-121093449.6 KB7页193
IC封装资料_电阻_0603WAF1001T5E.pdf
昆山厚聲電子工業有限公司UNIROYALELECTRONICSINDUSTRY(KUNSHAN)CO.,LTD.ApprovedCheckedPreparedFileNO.EditionDatePageWilliamZhaoAppleL...
2024-12-12379705.94 KB14页117
IC封装资料_电源管理芯片_LTC4071EDDB_TRPBF.pdf
LTC407114071fcTypicalapplicaTionDescripTionLi-Ion/PolymerShuntBatteryChargerSystemwithLowBatteryDisconnectTheLTC®4071allowssimple...
2024-12-12155326.12 KB18页250
IC封装资料_电容_CL10C390JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12169316.29 KB3页144
IC封装资料_电容_CL10A474KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A474KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12502361.46 KB3页272
IC封装资料_电容_CL10C390JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12262259.58 KB3页32

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