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IC封装资料_电容_GRM1555C1H151JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12932920.26 KB29页111
IC封装资料_电容_CL10C510JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12975259.57 KB3页172
IC封装资料_电容_GRM155R61A274KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1254920.26 KB29页278
IC封装资料_电容_CL10C500JC81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121237259.57 KB3页59
IC封装资料_连接器_1806300.pdf
https://www.phoenixcontact.com/us/products/180630010/27/2014Page1/5Basestrip-GMSTB2,5/10-GF-7,62-1806300Pleasebeinformedthatthedat...
2024-12-12341171.71 KB5页113
IC封装资料_电容_CL10B101KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12306259.58 KB3页158
IC封装资料_连接器_1806290.pdf
https://www.phoenixcontact.com/us/products/180629010/27/2014Page1/5Basestrip-GMSTB2,5/9-GF-7,62-1806290Pleasebeinformedthatthedata...
2024-12-121183169.28 KB5页83
IC封装资料_电容_CL10B101KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121687259.58 KB3页208
IC封装资料_电阻_RTA02-4D103JTH.pdf
RALEC旺詮厚膜排列晶片電阻器規格標準書文件編號IE-SP-008版本日期2015/05/06頁次1/14IEQASales備註發行管制章DATACenter.SeriesNo.60制訂...
2024-12-121331739.54 KB14页253
IC封装资料_电阻_RN14W10KFTBA1.pdf
21ReferenceStandardsIEC60115-1JISC5201-1RNseriesPRECISIONMETALFILMRESISTORSELECTRICALANDMECHANICALPERFORMANCEENVIRONMENTALCHARACTE...
2024-12-121781497.45 KB2页290
IC封装资料_电容_0805B472K501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-121101.26 MB20页137
IC封装资料_电容_GRM1555C1H160GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121550920.26 KB29页192
IC封装资料_电容_CL10C511JB81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12581452.9 KB21页264
IC封装资料_电容_0805B472K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210011.05 MB27页17
IC封装资料_电容_CL10C511JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12652316.3 KB3页22
IC封装资料_电感_SWPA252010S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125931.32 MB22页34
IC封装资料_电容_C1005NP0120JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-121451.92 MB48页10
IC封装资料_连接器_1758128.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12167836.13 MB445页251
IC封装资料_电容_C1005C0G1H330F050BA.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-129581.65 MB57页291
IC封装资料_连接器_1806326.pdf
https://www.phoenixcontact.com/us/products/180632610/27/2014Page1/5Housing-GMSTB2,5/12-GF-7,62-1806326Pleasebeinformedthatthedatas...
2024-12-12255169.28 KB5页4

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