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IC封装资料_电容_CL10B102KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121968334.92 KB3页296
IC封装资料_电容_CL10C680GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12781316.17 KB3页235
IC封装资料_电容_CL10C680FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121322259.57 KB3页85
IC封装资料_电容_0805B474K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121271.05 MB27页11
IC封装资料_电容_C1005X7R223KFTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1211441.92 MB48页281
IC封装资料_电感_SWPA252012S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211871.32 MB22页280
IC封装资料_非易失性存储器_GD5F1GQ4RB9IGR.pdf
SPI(x1/x2/x4)NANDFlash1G1GD5F1GQ4xBxIGDATASHEET更多资料下载请到五八文库wk.58sms.comSPI(x1/x2/x4)NANDFlash1G2Contents1FEATURE.........
2024-12-121751.42 MB50页169
IC封装资料_电源管理芯片_LTC4355CDE_TRPBF.pdf
LTC435514355ffFormoreinformationwww.linear.com/LTC4355FeaturesapplicationsDescriptionPositiveHighVoltageIdealDiode-ORwithInputSupp...
2024-12-121314317.96 KB20页227
IC封装资料_电容_GRM1555C1H220GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121928920.26 KB29页154
IC封装资料_电容_CL10C680JB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121322259.57 KB3页93
IC封装资料_电源管理芯片_LTC4355CS_TRPBF.pdf
LTC435514355ffFormoreinformationwww.linear.com/LTC4355FeaturesapplicationsDescriptionPositiveHighVoltageIdealDiode-ORwithInputSupp...
2024-12-121694317.96 KB20页107
IC封装资料_电容_CL10C680JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12773316.28 KB3页92
IC封装资料_电容_GRM155R61A684KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12170920.26 KB29页191
IC封装资料_电容_C1206B106K050T.pdf
HolyStoneEnterpriseCo.,Ltd.CERAMICCAPACITORCATALOGNCCSeriesCommericalgradeGeneralUpto50Vwww.holystone.com.twwww.holystonecaps.com...
2024-12-1210101.54 MB14页155
IC封装资料_电容_CL10B102KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12403259.58 KB3页183
IC封装资料_非易失性存储器_H26M41204HPR.pdf
Rev1.0/Aug.20151SKhynixe-NANDProductFamilyeMMC5.1Compatible更多资料下载请到五八文库wk.58sms.comRev1.0/Aug.20152RevisionHistoryRevi...
2024-12-126412.03 MB8页223
IC封装资料_电容_0805B501K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214391.05 MB27页40
IC封装资料_非易失性存储器_MT25QU01GBBB8E12-0SIT.pdf
MicronSerialNORFlashMemory1.8V,MultipleI/O,64KBSectorEraseMT25QU01GBBBFeatures•Stackeddevice(two512Mbdie)•SPI-compatibleserialbu...
2024-12-1218351.18 MB95页148
IC封装资料_电容_0805B475K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126871.05 MB27页108
IC封装资料_非易失性存储器_MB85RC16PNF.pdf
FUJITSUSEMICONDUCTORDATASHEETCopyright©2011FUJITSUSEMICONDUCTORLIMITEDAllrightsreserved2011.6MemoryFRAM16K(2K×8)BitI2CMB85RC16■...
2024-12-121341222.36 KB20页255

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