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IC封装资料_电容_0805CG1R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128811.05 MB27页253
IC封装资料_晶体管_MMBT4401LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2011October,2011−Rev.101PublicationOrderNumber:MMBT4401LT1/DMMBT4401L,SMMBT4401LSwitching...
2024-12-12301233.76 KB7页172
IC封装资料_晶体管_IRLML5203TR.pdf
ParameterMax.UnitsVDSDrain-SourceVoltage-30VID@TA=25°CContinuousDrainCurrent,VGS@-10V-3.0ID@TA=70°CContinuousDrainCurrent,VGS@-1...
2024-12-121004302.1 KB10页224
IC封装资料_电感_WPN201610H100MT.pdf
SunlordIndustrialPark,DafuyuanIndustrialZone,Guanlan,Shenzhen,China518110Tel:0086-755-29832660Fax:0086-755-82269029E-Mail:sunlord@...
2024-12-121797695.55 KB11页43
IC封装资料_电容_GRM1555C1H561JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121392920.26 KB29页202
IC封装资料_电容_CL10F334ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F334ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218481.42 MB36页298
IC封装资料_电源管理芯片_LTC6652AHMS8-2.048_PBF.pdf
LTC665216652fgFormoreinformationwww.linear.com/LTC6652FeaturesapplicationsDescriptionPrecisionLowDriftLowNoiseBufferedReferenceThe...
2024-12-1294629.27 KB20页224
IC封装资料_电容_CA0612KRX7R7BB104.pdf
ProductSpecification–November10,2015V.4DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSC-ArrayNP0/X7R/Y5V16VTO50Vsizes0508(4x040...
2024-12-1219021.05 MB17页116
IC封装资料_电源管理芯片_LTC4425IMSE_PBF.pdf
LTC442514425faFormoreinformationwww.linear.com/LTC4425TypicalapplicaTionFeaTuresDescripTionLinearSuperCapChargerwithCurrent-Limite...
2024-12-12983721 KB22页202
IC封装资料_连接器_1827923.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12123936.13 MB445页211
IC封装资料_电容_CL10B103KB85PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12208259.58 KB3页68
IC封装资料_电容_0805CG1R8C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214411.05 MB27页247
IC封装资料_电感_WPN201610U2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121253624.92 KB9页48
IC封装资料_电感_WPN201610HR47MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121886624.92 KB9页87
IC封装资料_电源管理芯片_LTC6652BHMS8-1.25_PBF.pdf
LTC665216652fgFormoreinformationwww.linear.com/LTC6652FeaturesapplicationsDescriptionPrecisionLowDriftLowNoiseBufferedReferenceThe...
2024-12-12169629.27 KB20页118
IC封装资料_电源管理芯片_LTC6652AHMS8-5_TRPBF.pdf
LTC665216652fgFormoreinformationwww.linear.com/LTC6652FeaturesapplicationsDescriptionPrecisionLowDriftLowNoiseBufferedReferenceThe...
2024-12-121147629.27 KB20页38
IC封装资料_电容_GRM155R61E225ME11D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12158910.43 MB296页46
IC封装资料_晶体管_ULN2001AD.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-126281.39 MB35页263
IC封装资料_电容_GRM1555C1H620JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12230920.26 KB29页14
IC封装资料_电容_CL10F393ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F393ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121097360.43 KB3页101

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