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IC封装资料_开关_K2-1107ST-A4SW-06.pdf
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2024-12-12782156.34 KB1页147
IC封装资料_电容_GRM1555C1H680JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12689920.26 KB29页134
IC封装资料_电容_CL10F683ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F683ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121015360.2 KB3页229
IC封装资料_电容_CC0201CRNPO9BN1R5.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-121111.22 MB13页53
IC封装资料_锂电池专用芯片_LP4056HSPF.pdf
AEN(seeNoteA)BChargePumpVCCD−D+1D−1D+2D−2D+SOEDigitalControlProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-122402.65 MB30页225
IC封装资料_开关_ST-1187.pdf
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2024-12-121915914.08 KB8页45
IC封装资料_电容_GRM1555C1H681JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121172920.26 KB29页58
IC封装资料_电源管理芯片_LTC6655CHMS8-5_PBF.pdf
LTC6655/LTC6655LN1Rev.GFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTION0.25ppmNoise,LowDriftPrecisionReferencesTheLTC...
2024-12-1211582.42 MB30页203
IC封装资料_电容_CL10X106MO8NRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10X106MO8NRNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210971.28 MB36页142
IC封装资料_电容_CL10F823ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F823ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12896360.21 KB3页236
IC封装资料_电容_CL10B103MB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103MB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121868360.79 KB3页55
IC封装资料_电容_CL10F684ZP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F684ZP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12703360.45 KB3页173
IC封装资料_电容_CC0201CRNPO9BN1R6.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128871.22 MB13页137
IC封装资料_电容_CL10B103MB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121710259.58 KB3页216
IC封装资料_连接器_0.5K-DX-6PWB.pdf
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2024-12-121587453.69 KB1页37
IC封装资料_电容_0805CG3R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127931.05 MB27页298
IC封装资料_连接器_0.5K-AX-8PWB.pdf
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2024-12-1289480.35 KB1页211
IC封装资料_电感_WPN252010H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121432624.92 KB9页188
IC封装资料_电容_GRM1555C1H750JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12124920.26 KB29页31
IC封装资料_电容_CL10X106MR8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121780259.58 KB3页222

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