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IC封装资料_电容_CL10B224KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12659259.58 KB3页109
IC封装资料_电容_CL31F226ZPHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31F226ZPHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-126301.48 MB36页18
IC封装资料_电容_0805N180J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210511.26 MB20页14
IC封装资料_连接器_A2541HWV-30P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121834814.89 KB16页15
IC封装资料_电感_YP0301-220M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12883719.3 KB5页197
IC封装资料_连接器_A2541HWV-29P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12619814.98 KB16页238
IC封装资料_连接器_1759101.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1267336.13 MB445页14
IC封装资料_连接器_A2541HWV-28P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12632814.72 KB16页203
IC封装资料_电容_GRM1885C2A2R2CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121198944.07 KB30页213
IC封装资料_电容_CL32A226KOJNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL32A226KOJNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123121.48 MB36页255
IC封装资料_电容_CL32A106KBJNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL32A106KBJNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-121527421.39 KB3页218
IC封装资料_连接器_A2541HWV-31P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121848814.73 KB16页199
IC封装资料_电容_GRM1885C2A3R3CA01D.pdf
GRM1885C2A3R3CA01_(0603,C0G:EIA,3.3pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121090944 KB30页179
IC封装资料_电容_CL32B106KAULNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL32B106KAULNNE·Product:Multi-layerCeramicCapacitor...
2024-12-129691.47 MB36页198
IC封装资料_电容_CC0402JRNPO9BN300.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12129917.81 MB176页262
IC封装资料_电源管理芯片_NCR321ZX.pdf
NCR320Z/NCR321Z250mALEDdriverinSOT223Rev.1—4February2019Productdatasheet1.Productprofile1.1.GeneraldescriptionLEDdriverconsisting...
2024-12-121683539.95 KB18页116
IC封装资料_电容_GRM155R71H823KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12966920.26 KB29页261
IC封装资料_电容_GRM1885C2A4R7BA01D.pdf
GRM1885C2A4R7BA01_(0603,C0G:EIA,4.7pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121944943.98 KB30页259
IC封装资料_电容_CL10B224KO8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KO8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-12753361.59 KB3页200
IC封装资料_连接器_A2541HWV-33P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12124814.99 KB16页127

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