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IC封装资料_连接器_DF12C-32DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12180288.67 KB11页59
IC封装资料_电源管理芯片_SY8032EABC.pdf
SY8032GenerTheSY8synchronodeliveringoperateso5.5VandswitchwconductioLowoutpandcapac1MHzswiOrderSY8032□OrderinSY803TypicFON/OVINCI...
2024-12-1215333.47 MB11页205
IC封装资料_连接器_DF12C-30DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121552288.67 KB11页291
IC封装资料_连接器_DF12C-20DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12570288.67 KB11页133
IC封装资料_电容_GRM188R71C154KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121076944.07 KB30页168
IC封装资料_电容_RVT2A470M1010-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1216571.08 MB3页6
IC封装资料_电容_CL10B474KO8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B474KO8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-122571.45 MB36页107
IC封装资料_电容_ERS1HM100D11OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12140615.39 MB230页25
IC封装资料_电容_1206B683K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121231.05 MB27页92
IC封装资料_电感_YPRH104R-220M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12701762.21 KB4页142
IC封装资料_电感_YPRH104R-151M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12101762.21 KB4页49
IC封装资料_电容_GRM188R71C184KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121893944.07 KB30页249
IC封装资料_连接器_DF12D_3.0_-10DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12207288.67 KB11页275
IC封装资料_电容_CL10B474KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12562259.58 KB3页181
IC封装资料_连接器_DF12C-60DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121683288.67 KB11页262
IC封装资料_连接器_DF12C-50DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12695288.67 KB11页60
IC封装资料_电容_1206B684K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215631.05 MB27页122
IC封装资料_连接器_DF12D_3.0_-32DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121972288.67 KB11页285
IC封装资料_电感_YPRH104R-221M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121956762.21 KB4页180
IC封装资料_连接器_DF12D_3.0_-30DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-1256288.67 KB11页55

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