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IC封装资料_电容_CL10B474KO8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B474KO8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-122561.45 MB36页107
IC封装资料_电容_ERS1HM100D11OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12140615.39 MB230页25
IC封装资料_电容_1206B683K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121221.05 MB27页92
IC封装资料_电感_YPRH104R-220M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12701762.21 KB4页142
IC封装资料_电感_YPRH104R-151M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12101762.21 KB4页49
IC封装资料_电容_GRM188R71C184KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121892944.07 KB30页249
IC封装资料_连接器_DF12D_3.0_-10DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12206288.67 KB11页275
IC封装资料_电容_CL10B474KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12561259.58 KB3页181
IC封装资料_连接器_DF12C-60DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121682288.67 KB11页262
IC封装资料_连接器_DF12C-50DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12695288.67 KB11页60
IC封装资料_电容_1206B684K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215621.05 MB27页122
IC封装资料_连接器_DF12D_3.0_-32DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121971288.67 KB11页285
IC封装资料_电感_YPRH104R-221M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121956762.21 KB4页180
IC封装资料_连接器_DF12D_3.0_-30DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-1255288.67 KB11页55
IC封装资料_连接器_DF12D_3.0_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12764288.67 KB11页112
IC封装资料_电源管理芯片_SY8113BADC.pdf
ApplicationNote:SY8113BHighEfficiency,500kHz,3A,18VInputSynchronousStepDownRegulatorAN_SY8113BRev.0.1SilergyCorp.Confidential-prep...
2024-12-12801.13 MB10页289
IC封装资料_连接器_DF12D_3.0_-14DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12508288.67 KB11页246
IC封装资料_电容_GRM188R71C224KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12160944.07 KB30页218
IC封装资料_电容_SA10BM331A19R09XXX.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1286215.39 MB230页152
IC封装资料_电容_CL10B474KO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B474KO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1215651.45 MB36页87

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