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IC封装资料_连接器_FH28-10S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-12899492.73 KB12页242
IC封装资料_连接器_FH12-26S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12337339.76 KB6页266
IC封装资料_电容_CL10B683KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-126921.45 MB36页141
IC封装资料_连接器_FH12-22S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12957339.76 KB6页220
IC封装资料_连接器_FH12-17S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12999339.76 KB6页86
IC封装资料_电容_1206CG121J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121191.05 MB27页266
IC封装资料_电容_T491A475K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-129091.54 MB23页106
IC封装资料_电感_YPRH1204-101M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12810735.47 KB5页147
IC封装资料_电容_T491A475K010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-126681.54 MB23页159
IC封装资料_电感_YPRH1204-100M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-1275735.47 KB5页80
IC封装资料_电容_GCJ21BR71H104KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1218765.94 MB73页21
IC封装资料_电源管理芯片_TLC5973DR.pdf
GNDVCCControllerOUT0SDOSDIVCCGNDIREFOUT1OUT2DeviceOUT0SDOSDIVCCGNDIREFOUT1OUT2DeviceRIREFRIREFPowerSupply(5V)ProductFolderOrderNow...
2024-12-123331.38 MB37页24
IC封装资料_电容_GRM188R71H104MA93D.pdf
GRM188R71H104MA93_(0603,X7R:EIA,0.1uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121292962.36 KB30页151
IC封装资料_连接器_FH28-60S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-121875492.73 KB12页260
IC封装资料_连接器_FH28-45S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-121044492.73 KB12页211
IC封装资料_电容_CL10B683KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12377360.67 KB3页79
IC封装资料_连接器_FH28-40S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-12568492.73 KB12页130
IC封装资料_电容_1206CG150J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128181.05 MB27页9
IC封装资料_连接器_FH28-15S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-12136492.73 KB12页92
IC封装资料_电容_T491A475K025AT.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardT2005_T491•8/20/2018FortLauderdale,FL33301USA•954-766-2800•w...
2024-12-125111.47 MB23页84

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