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IC封装资料_电容_TAJB475K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12347210.32 KB7页244
IC封装资料_电源管理芯片_TPS43061RTER.pdf
TPS43060/61ISNS-ISNS+VINENPGOODFBAGNDVCCBOOTCOMPRT/CLKSSVINVOUTRSENSELQHQLCICODBOOT(Note1)CBOOTCVCCCSSCCRCRTRSHRSLNote1:DBOOTisreq...
2024-12-1216331.87 MB43页2
IC封装资料_电容_TAJB474M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12766210.32 KB7页244
IC封装资料_电容_TAJB474M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121805210.32 KB7页236
IC封装资料_电源管理芯片_TPS43060RTER.pdf
TPS43060/61ISNS-ISNS+VINENPGOODFBAGNDVCCBOOTCOMPRT/CLKSSVINVOUTRSENSELQHQLCICODBOOT(Note1)CBOOTCVCCCSSCCRCRTRSHRSLNote1:DBOOTisreq...
2024-12-125901.84 MB43页243
IC封装资料_电容_TAJB474K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12923210.32 KB7页120
IC封装资料_电容_TAJB474K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12562210.32 KB7页1
IC封装资料_电容_CL10C6R8DC81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121953452.9 KB21页18
IC封装资料_电容_GCJ216R72A102KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-126545.94 MB73页108
IC封装资料_电容_CL10C6R8DB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121951259.58 KB3页62
IC封装资料_电容_1210B224K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121551.05 MB27页200
IC封装资料_嵌入式微处理器_STC8G1K08A-36I-SOP8.pdf
STCmicroTM宏晶科技深圳国芯人工智能有限公司STC8G系列单片机技术参考手册技术支持网站：www.STCMCUDATA.com/www.STCMCU.com资料更新日期：...
2024-12-12163226.52 MB909页238
IC封装资料_电感_YSPI0730-R47M.pdf
SMDPowerInductors-YSPI0730Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-12766702.26 KB5页292
IC封装资料_电感_YSPI0730-R22M.pdf
SMDPowerInductors-YSPI0730Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121955702.26 KB5页174
IC封装资料_电源管理芯片_TPS51200DRCR.pdf
23451987610TPS51200REFINVLDOINVOPGNDVOSNSVINPGOODGNDENREFOUT3.3VINPGOODSLP_S3VTTREFVLDOINVTTVDDQCopyright©2016,TexasInstrumentsIn...
2024-12-1212802.11 MB39页106
IC封装资料_电容_CL10C7R5CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121029259.58 KB3页31
IC封装资料_电容_CL10C7R5BB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12168316.21 KB3页35
IC封装资料_电容_1210B472K202NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214421.05 MB27页264
IC封装资料_电容_1210B225K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128031.05 MB27页283
IC封装资料_电容_TAJB475K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12558210.32 KB7页24

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