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IC封装资料_电容_CGA2B3X7S1A474K050BE.pdf
January2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSCGA21005[0402inch]CGA31608...
2024-12-12768723.56 KB18页252
IC封装资料_电源管理芯片_LTC3789EGN_TRPBF.pdf
LTC378913789fcFormoreinformationwww.linear.com/LTC3789TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighEfficiency,Synchronous,...
2024-12-12315611.07 KB30页283
IC封装资料_电容_0603F683Z500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214631.26 MB20页293
IC封装资料_电感_SPM6530T-1R0M120.pdf
INDUCTORSMay2016WoundMetalSPM6530InductorsforPowerCircuitsSPM6530TypeSPMSeries更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20...
2024-12-12591207.88 KB9页235
IC封装资料_电源管理芯片_LTC3789EGN_PBF.pdf
LTC378913789fcFormoreinformationwww.linear.com/LTC3789TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighEfficiency,Synchronous,...
2024-12-121037611.07 KB30页9
IC封装资料_电感_SLF10145T-680M1R2-PF.pdf
INDUCTORSApril2016��SLF10145��SLF10145�SLF��更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20160411/in...
2024-12-121688353.89 KB9页298
IC封装资料_电容_CL10A105KL8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12348259.57 KB3页240
IC封装资料_电源管理芯片_LTC2938IMS_PBF.pdf
LTC2938/LTC29391293839ffV1(V)V2(V)V3(V)V4(V)V5(V)V6(V)53.32.51.8ADJADJ53.32.5ADJADJADJ53.31.8ADJADJADJ53.3ADJADJADJADJ53.3ADJ–ADJ...
2024-12-12857338.78 KB20页284
IC封装资料_电源管理芯片_LTC2924IGN_PBF.pdf
LTC292412924fcFormoreinformationwww.linear.com/LTC2924TypicalapplicaTionFeaTuresDescripTionQuadPowerSupplySequencerTheLTC®2924isa...
2024-12-12107452.93 KB22页174
IC封装资料_电容_0805B123K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
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IC封装资料_电容_0805B123K500CT.pdf
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2024-12-1217851.26 MB20页134
IC封装资料_电容_GRM15XR71C332KA86D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121095920.26 KB29页213
IC封装资料_电容_CGA3E1X7R1V334M080AC.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-1211301.67 MB57页294
IC封装资料_电容_0603F684Z160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
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IC封装资料_电感_SWPA5040S330MT.pdf
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IC封装资料_电源管理芯片_LTC3789EUFD_TRPBF.pdf
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2024-12-12849611.07 KB30页94
IC封装资料_电感_SPM6530T-1R5M100.pdf
INDUCTORSMay2016WoundMetalSPM6530InductorsforPowerCircuitsSPM6530TypeSPMSeries更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20...
2024-12-12315207.88 KB9页296
IC封装资料_电容_GRM033R61C104KE84D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1270510.43 MB296页11
IC封装资料_电源管理芯片_LTC2941CDCB_TRPBF.pdf
LTC29411Rev.CFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTIONBatteryGasGaugewithI2CInterfaceTheLTC®2941measuresbatte...
2024-12-121819769.24 KB18页102
IC封装资料_电容_GRM21BB31C106KE15L.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM21BB31C106KE15_(0805,B(JIS),10uF,DC16V)_:PackagingCodeReferenceSheet■ScopeThis...
2024-12-121533882.2 KB30页92

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