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IC封装资料_电容_CGA5L3X8R1H105K160AB.pdf
April2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSCGA21005[0402inch]CGA31608[0603inch]CGA42012[0805inch]CGA53...
2024-12-12782724.43 KB16页273
IC封装资料_电容_0805B152K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211961.26 MB20页274
IC封装资料_电容_0603N2R7C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-122081.26 MB20页163
IC封装资料_电感_SWPA6020S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216011.32 MB22页173
IC封装资料_电容_0603N2R2C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214511.26 MB20页257
IC封装资料_电容_CL10A105KP8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A105KP8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-129251.42 MB36页242
IC封装资料_电感_SWPA3010S3R3NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127111.32 MB22页219
IC封装资料_电感_SWPA3010S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125011.32 MB22页122
IC封装资料_电源管理芯片_LTC2951ITS8-2_TRMPBF.pdf
LTC2951-1/LTC2951-21295112fbTYPICALAPPLICATIONAPPLICATIONSFEATURESDESCRIPTIONPushbuttonOn/OffControllerTheLTC®2951isamicropower,w...
2024-12-124451.86 MB20页88
IC封装资料_电源管理芯片_LTC3810IG_TRPBF.pdf
LTC381013810fc100VCurrentModeSynchronousSwitchingRegulatorControllerTheLTC3810isasynchronousstep-downswitchingregulatorcontrollert...
2024-12-121369563.9 KB38页166
IC封装资料_电容_GRM21BR60J106KE19L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1220810.43 MB296页123
IC封装资料_电源管理芯片_LTC3803HS6-5_TRPBF.pdf
LTC3803-5138035fdTYPICALAPPLICATIONDESCRIPTIONConstantFrequencyCurrentModeFlybackDC/DCControllerinThinSOTTheLTC®3803-5isaconstant...
2024-12-12135250.58 KB16页2
IC封装资料_电容_GRM033R61C473KE84D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1224110.43 MB296页29
IC封装资料_电容_CL03A103KP3NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-12801.42 MB36页268
IC封装资料_电容_CL10A105KP8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12925259.58 KB3页200
IC封装资料_电容_0603N3R0C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216941.26 MB20页228
IC封装资料_电容_0805B152K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-121351.26 MB20页174
IC封装资料_电感_SWPA3010S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125081.32 MB22页178
IC封装资料_电感_SWPA3010S6R8MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-124011.32 MB22页17
IC封装资料_连接器_1757352.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12152436.13 MB445页4

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