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IC封装资料_电容_GRM1555C1H8R2CA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121254920.26 KB29页237
IC封装资料_电容_0805B301K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214021.05 MB27页274
IC封装资料_电容_CL10C330JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215161.39 MB36页53
IC封装资料_电容_0805B273K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126411.05 MB27页208
IC封装资料_电容_CL10C330GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121109316.19 KB3页171
IC封装资料_电感_SWPA6045S221MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128011.32 MB22页6
IC封装资料_电感_SWPA6045S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125761.32 MB22页270
IC封装资料_电容_CL10C330FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121655259.58 KB3页286
IC封装资料_电容_C0603C105K8PACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-121311.48 MB25页206
IC封装资料_电容_C0603C104K3RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-122401.48 MB25页13
IC封装资料_电源管理芯片_LTC4008EGN_PBF.pdf
LTC40081RevCFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTION4A,HighEfficiency,Multi-ChemistryBatteryCharger12.3V,4ALi...
2024-12-12910312.69 KB24页18
IC封装资料_电容_GRM155R60J225KE95D.pdf
GRM155R60J225KE95_(0402,X5R:EIA,2.2uF,DC6.3V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12864924.34 KB29页200
IC封装资料_连接器_1803497.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12111236.13 MB445页249
IC封装资料_电容_CL10A226MQ8NRNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12703259.58 KB3页40
IC封装资料_电感_SWPA6045S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128401.32 MB22页192
IC封装资料_电源管理芯片_LTC4009CUF-1_TRPBF.pdf
4009fdLTC4009LTC4009-1/LTC4009-2TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighEfficiency,Multi-ChemistryBatteryChargerTheLT...
2024-12-121365439.45 KB28页214
IC封装资料_电容_GRM155R60J225ME15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12415920.26 KB29页148
IC封装资料_电容_0805B302K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128871.05 MB27页13
IC封装资料_电感_SWPA6045S331MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125551.32 MB22页252
IC封装资料_电源管理芯片_LTC4009IUF-1_PBF.pdf
4009fdLTC4009LTC4009-1/LTC4009-2TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighEfficiency,Multi-ChemistryBatteryChargerTheLT...
2024-12-12595439.45 KB28页126

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