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IC封装资料_电容_CL10A475KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121731259.58 KB3页79
IC封装资料_电容_0805B391K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218711.05 MB27页101
IC封装资料_电容_CL10C391JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C391JB81PNC●Product:Multi-layerCeramicCapacitorCAP,390㎊,50V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1219035.8 MB36页294
IC封装资料_电感_SWPA8040S151MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215141.32 MB22页4
IC封装资料_电感_SWPA8040S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-123761.32 MB22页148
IC封装资料_电容_C0603X7R471KGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1218301.92 MB48页218
IC封装资料_连接器_1803510.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12184036.13 MB445页206
IC封装资料_电源管理芯片_LTC4089EDJC_TRPBF.pdf
LTC4089/LTC4089-5140895fdFormoreinformationwww.linear.com/LTC4089ApplicAtionsHVINBOOSTHVENINSW4.7µF10µF4.7µF1µFTIMERCLPROGLTC4...
2024-12-12704806 KB26页277
IC封装资料_电容_GRM155R61A103KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121506920.26 KB29页64
IC封装资料_电容_CL10A475KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A475KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1215991.42 MB36页280
IC封装资料_电容_CL10A475KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121205259.58 KB3页113
IC封装资料_电容_0805B391K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125931.05 MB27页73
IC封装资料_电感_SWPA8040S180MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215611.32 MB22页291
IC封装资料_连接器_1758115.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12110336.13 MB445页267
IC封装资料_电阻_3314J-1-103E.pdf
3121.0(.040)3PLCS.0.8±0.1(.031±.004)2PLCS.2.35(.093)2.3(.091)1.3(.051)2PLCS.2.0(.079)2.0(.079)3PLCS.3314J-10.20(.008)4.50(.177)4...
2024-12-127241.11 MB5页26
IC封装资料_电阻_3296W-1-501.pdf
产品品牌博晨（BOCHEN)3296W型玻璃釉预调电位器技术承认书拟制：审核：批准：更多资料下载请到五八文库wk.58sms.com3296W型玻璃釉预调电位...
2024-12-121760210.39 KB4页180
IC封装资料_电容_GRM1555C1H120GA01D.pdf
GRM1555C1H120GA01_(0402,C0G:EIA,12pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12988944.26 KB30页215
IC封装资料_电容_CL10C431JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12324259.58 KB3页180
IC封装资料_电容_CL10C430JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12507259.58 KB3页130
IC封装资料_电容_CL10C391KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12150316.5 KB3页176

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