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IC封装资料_非易失性存储器_MT25QU01GBBB8E12-0SIT.pdf
MicronSerialNORFlashMemory1.8V,MultipleI/O,64KBSectorEraseMT25QU01GBBBFeatures•Stackeddevice(two512Mbdie)•SPI-compatibleserialbu...
2024-12-1218351.18 MB95页148
IC封装资料_电容_0805B475K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126871.05 MB27页108
IC封装资料_非易失性存储器_MB85RC16PNF.pdf
FUJITSUSEMICONDUCTORDATASHEETCopyright©2011FUJITSUSEMICONDUCTORLIMITEDAllrightsreserved2011.6MemoryFRAM16K(2K×8)BitI2CMB85RC16■...
2024-12-121340222.36 KB20页255
IC封装资料_电容_GRM1555C1H221FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121949920.26 KB29页89
IC封装资料_电感_SWPA252012S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218301.32 MB22页190
IC封装资料_电容_GRM1555C1H220JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121886920.26 KB29页77
IC封装资料_电容_CL10C680JB8NNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-129777.55 MB84页201
IC封装资料_电源管理芯片_LTC4355IDE_PBF.pdf
LTC435514355ffFormoreinformationwww.linear.com/LTC4355FeaturesapplicationsDescriptionPositiveHighVoltageIdealDiode-ORwithInputSupp...
2024-12-12463317.95 KB20页180
IC封装资料_电容_CL10B102KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B102KB8WPNC●Product:Multi-layerCeramicCapacitorCAP,1㎋,50V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-126965.82 MB36页144
IC封装资料_电容_C1206C104K3RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-126311.48 MB25页189
IC封装资料_电源管理芯片_LTC4355IS_TRPBF.pdf
LTC435514355ffFormoreinformationwww.linear.com/LTC4355FeaturesapplicationsDescriptionPositiveHighVoltageIdealDiode-ORwithInputSupp...
2024-12-121429317.96 KB20页83
IC封装资料_电容_C1206C475K5PACTU.pdf
Generated5/23/2013-f2edba9d-a22e-436e-8c60-774045a4d567KEMETPartNumber:C1206C475K5PACTU(C1206C475K5PAC7800)Capacitor,Ceramic,SMD,M...
2024-12-121293155.17 KB1页263
IC封装资料_电容_C1206C104K5RACAUTO.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-1211201.48 MB25页224
IC封装资料_电容_GRM155R61A824KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121735920.26 KB29页78
IC封装资料_非易失性存储器_MX25U25635FMI10G.pdf
MX25U25635FP/N:PM1712MX25U25635FDATASHEET更多资料下载请到五八文库wk.58sms.com2MX25U25635FREV.1.2,NOV.28,2013P/N:PM1712Contents1.FE...
2024-12-1218281.5 MB96页124
IC封装资料_电容_0805B511K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214651.05 MB27页244
IC封装资料_电容_GRM1555C1H221JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121890920.26 KB29页252
IC封装资料_电容_0805B502K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218901.05 MB27页155
IC封装资料_电容_GRM1555C1H221GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12873920.26 KB29页258
IC封装资料_电容_CL10C680JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12261316.29 KB3页203

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