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IC封装资料_电容_GRM1555C1H750JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12124920.26 KB29页31
IC封装资料_电感_WPN252010H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121432624.92 KB9页188
IC封装资料_电源管理芯片_LTC6803HG-1_PBF.pdf
LTC6803-1/LTC6803-31680313faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-12152504.73 KB40页201
IC封装资料_电容_CL10X106MR8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121780259.58 KB3页222
IC封装资料_电容_CL10X106MQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12662259.58 KB3页30
IC封装资料_电容_CL10X106MP8NRNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121160259.58 KB3页226
IC封装资料_电容_GRM155R61E225ME15D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1274210.43 MB296页8
IC封装资料_电容_CC0201CRNPO9BN2R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126131.22 MB13页92
IC封装资料_连接器_0.5K-DX-12PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121571453.69 KB1页113
IC封装资料_连接器_0.5K-DX-10PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121408453.69 KB1页256
IC封装资料_连接器_0.5K-DX-8PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121790453.69 KB1页285
IC封装资料_电容_GRM1555C1H751JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121335920.26 KB29页30
IC封装资料_电容_CL10B104JA8NNNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121244452.9 KB21页158
IC封装资料_电容_CL10X475KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10X475KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125691.45 MB36页265
IC封装资料_电容_CL10X226MR8NUNE.pdf
SPECIFICATIONSupplier:Samsungelectro-mechanicsSamsungP/N:CL10X226MR8NUNEProduct:Multi-layerCeramicCapacitorDescription:CAP...
2024-12-121832222.28 KB2页42
IC封装资料_电容_0805CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129751.05 MB27页85
IC封装资料_电容_CC0201CRNPO9BN2R2.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1213331.22 MB13页295
IC封装资料_电感_WPN252010HR68MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12764624.92 KB9页115
IC封装资料_连接器_1827949.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12118736.13 MB445页140
IC封装资料_电感_WPN252010H100MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121535624.92 KB9页11

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