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IC封装资料_电容_0805CG122J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123061.05 MB27页6
IC封装资料_电感_YNR3015-1R0M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121779665.41 KB5页24
IC封装资料_电容_GRM1885C1H1R8BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121787944.07 KB30页243
IC封装资料_电感_YNR3010-470M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121524661.07 KB5页210
IC封装资料_电容_CC0201MRX5R5BB104.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-12691.22 MB13页145
IC封装资料_连接器_1829196.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deJan25,2011ExtractfromtheonlinecatalogGMSTBV2,5/6-GF-7,62OrderNo.:1...
2024-12-121881238.34 KB5页243
IC封装资料_电源管理芯片_LTM8023EV_PBF.pdf
LTM802318023fjFormoreinformationwww.linear.com/LTM8023LOADCURRENT(A)0.01EFFICIENCY(%)POWERLOSS(W)55500.11108023TA01b65609080708575...
2024-12-121024605.04 KB24页15
IC封装资料_连接器_1829183.pdf
https://www.phoenixcontact.com/us/products/182918310/28/2014Page1/5Basestrip-GMSTBV2,5/5-GF-7,62-1829183Pleasebeinformedthatthedat...
2024-12-121737177.77 KB5页255
IC封装资料_电容_GRM1885C1H1R8CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121413944.07 KB30页260
IC封装资料_电容_GRM155R71C104KA88J.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12151810.43 MB296页96
IC封装资料_电容_CC0201MRX5R5BB105.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126001.22 MB13页145
IC封装资料_连接器_1829219.pdf
https://www.phoenixcontact.com/pi/products/182921904/09/2019Page1/4Feed-throughheader-GMSTBV2,5/8-GF-7,62-1829219Pleasebeinformedt...
2024-12-121217190.55 KB4页124
IC封装资料_连接器_1829206.pdf
https://www.phoenixcontact.com/us/products/182920610/28/2014Page1/5Basestrip-GMSTBV2,5/7-GF-7,62-1829206Pleasebeinformedthatthedat...
2024-12-121386177.77 KB5页145
IC封装资料_电容_GRM1885C1H2R0BA01D.pdf
GRM1885C1H2R0BA01_(0603,C0G:EIA,2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121519944.09 KB30页276
IC封装资料_电容_CL10B104KO8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KO8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-126701.45 MB36页40
IC封装资料_电容_CC0201MRX5R5BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-122681.22 MB13页259
IC封装资料_电容_0805CG151J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123021.05 MB27页260
IC封装资料_连接器_1829248.pdf
https://www.phoenixcontact.com/us/products/182924810/28/2014Page1/5Basestrip-GMSTBV2,5/11-GF-7,62-1829248Pleasebeinformedthattheda...
2024-12-12664177.73 KB5页125
IC封装资料_电容_0805CG150J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218221.05 MB27页47
IC封装资料_连接器_1829235.pdf
https://www.phoenixcontact.com/pi/products/182923504/09/2019Page1/4Feed-throughheader-GMSTBV2,5/10-GF-7,62-1829235Pleasebeinformed...
2024-12-121725190.64 KB4页240

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