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IC封装资料_电容_CL21A226MQCLRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A226MQCLRNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218291.48 MB36页176
IC封装资料_电感_YNR3015-151M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121331665.41 KB5页61
IC封装资料_连接器_1759033.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12175236.13 MB445页286
IC封装资料_电容_CL21A226MPQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1219181.42 MB36页188
IC封装资料_连接器_1830606.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12123536.13 MB445页265
IC封装资料_电容_GRM1885C1H3R3BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12937944.07 KB30页219
IC封装资料_电容_GRM155R71C223KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121715920.26 KB29页300
IC封装资料_电容_CL21A226MQQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213281.42 MB36页159
IC封装资料_电容_CL10B105KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-129911.45 MB36页242
IC封装资料_电容_GRM1885C1H3R6BA01D.pdf
GRM1885C1H3R6BA01_(0603,C0G:EIA,3.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12958944.1 KB30页126
IC封装资料_电感_YNR3015-220M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121796665.41 KB5页30
IC封装资料_电容_GRM1885C1H3R3CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1295944.07 KB30页25
IC封装资料_电容_CL21A226MQQNNNF.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1213107.55 MB84页34
IC封装资料_电源管理芯片_MAX809SEUR_T.pdf
GeneralDescriptionTheMAX803/MAX809/MAX810aremicroprocessor(μP)supervisorycircuitsusedtomonitorthepowersuppliesinμPanddigitalsyst...
2024-12-12328941.05 KB8页256
IC封装资料_电源管理芯片_MAX706RCSA.pdf
GeneralDescriptionTheMAX706P/R/S/T,MAX706AP/AR/AS/AT,andMAX708R/S/Tmicroprocessor(µP)supervisorycircuitsreducethecomplexityandnum...
2024-12-121673873.18 KB15页147
IC封装资料_电容_GRM1885C1H3R9BA01D.pdf
GRM1885C1H3R9BA01_(0603,C0G:EIA,3.9pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121184944.11 KB30页247
IC封装资料_电容_GRM1885C1H3R6CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121751944.07 KB30页160
IC封装资料_电容_GRM155R71C224KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121306920.26 KB29页132
IC封装资料_电容_CL10B105KA8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KA8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-1216531.45 MB36页248
IC封装资料_电容_CL21A475KPFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A475KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-129321.42 MB36页152

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