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IC封装资料_电容_CL21B103KCANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-12537.46 MB84页67
IC封装资料_电源管理芯片_MAX6071AAUT50+T.pdf
19-6355;Rev17;6/20GeneralDescriptionTheMAX6070/MAX6071offeraverylownoiseandlow-driftvoltagereferenceinasmall6-pinSOT23package.Thes...
2024-12-122266.31 MB26页261
IC封装资料_连接器_1830651.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1253536.13 MB445页189
IC封装资料_电感_YNR4018-4R7M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12469661.38 KB5页38
IC封装资料_电容_CL10B105KO8SFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KO8SFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215591.45 MB36页62
IC封装资料_电容_CL10B105KO8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121663259.58 KB3页285
IC封装资料_电容_0805CG222J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218301.05 MB27页128
IC封装资料_电感_YNR4018-100M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121229661.38 KB5页34
IC封装资料_电感_YNR4018-6R8M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12739661.38 KB5页122
IC封装资料_电源管理芯片_MAX6225AESA+.pdf
GeneralDescriptionTheMAX6225/MAX6241/MAX6250arelow-noise,pre-cisionvoltagereferenceswithextremelylow1ppm/°Ctemperaturecoefficient...
2024-12-129502.39 MB11页173
IC封装资料_电容_GRM1885C1H5R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1251944.07 KB30页262
IC封装资料_电容_GRM155R71C333KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121641920.26 KB29页15
IC封装资料_电容_0805CG240J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212851.05 MB27页279
IC封装资料_电容_GRM1885C1H5R0BA01D.pdf
GRM1885C1H5R0BA01_(0603,C0G:EIA,5pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12772944.09 KB30页284
IC封装资料_电容_CL21B104KACNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-126041.45 MB36页273
IC封装资料_电容_GRM1885C1H5R1BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12570944.07 KB30页286
IC封装资料_电容_GRM155R71C393KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12421920.26 KB29页183
IC封装资料_电容_CL21B104KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B104KBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121580361.42 KB3页194
IC封装资料_电容_CL10B105KO84PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B105KO84PNC●Product:Multi-layerCeramicCapacitorCAP,1㎌,16V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-1218685.82 MB36页112
IC封装资料_电容_CC0402CRNPO9BN1R5.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12100317.81 MB176页24

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