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IC封装资料_电容_CL21B221KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B221KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12716360.66 KB3页260
IC封装资料_电容_CL21B201KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-124361.45 MB36页82
IC封装资料_电容_0805CG331J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127441.05 MB27页131
IC封装资料_电感_YNR4030-6R8M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121175664.95 KB5页17
IC封装资料_电容_GRM1885C1H8R2CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12644944.07 KB30页274
IC封装资料_电容_GRM1885C1H8R2BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12795944.07 KB30页255
IC封装资料_电感_YNR4030-4R7M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121799664.95 KB5页3
IC封装资料_电容_CL21B222KCANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1216907.55 MB84页56
IC封装资料_电源管理芯片_MC7818CTG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-12831296.53 KB31页195
IC封装资料_电源管理芯片_MC7815CTG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-12619296.53 KB31页14
IC封装资料_电容_GRM1885C1H9R0BA01D.pdf
GRM1885C1H9R0BA01_(0603,C0G:EIA,9pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12219944.09 KB30页84
IC封装资料_电容_GRM155R71E103KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12108920.26 KB29页245
IC封装资料_电容_GRM1885C1H8R2DA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12175944.07 KB30页42
IC封装资料_电容_CL10B122KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B122KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219801.45 MB36页209
IC封装资料_电容_CL21B224KCFSFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B224KCFSFNE·Product:Multi-layerCeramicCapacitor...
2024-12-125141.45 MB36页49
IC封装资料_电容_0805CG360J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122731.05 MB27页274
IC封装资料_电容_CL21B224KAFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123881.46 MB36页182
IC封装资料_连接器_1830680.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1291236.13 MB445页73
IC封装资料_电感_YNR4030-101M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121909664.95 KB5页60
IC封装资料_电感_YNR4030-100M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121790664.95 KB5页196

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