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IC封装资料_电容_0805CG560J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122621.05 MB27页115
IC封装资料_电容_CC0402CRNPO9BN6R2.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121884998.46 KB11页193
IC封装资料_电感_YNR5020-1R0M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121476664.7 KB5页64
IC封装资料_电容_CC0402CRNPO9BN5R6.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123161.22 MB13页291
IC封装资料_连接器_1830703.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1240836.13 MB445页254
IC封装资料_电源管理芯片_MCP1703T-3302E_MB.pdf
©2011MicrochipTechnologyInc.DS22049F-page1MCP1703Features:•2.0µATypicalQuiescentCurrent•InputOperatingVoltageRange:2.7Vto16.0V...
2024-12-12631828.08 KB32页251
IC封装资料_电容_GRM155R71E223KA61D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12419920.26 KB29页253
IC封装资料_电容_CL10B152JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1255259.58 KB3页183
IC封装资料_电容_0805CG561J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129631.05 MB27页179
IC封装资料_电感_YNR5020-2R2M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12726664.7 KB5页71
IC封装资料_电感_YNR5020-1R5M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-1299664.7 KB5页109
IC封装资料_电容_CL10B152KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B152KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216271.45 MB36页161
IC封装资料_电源管理芯片_MCP1826S-3302E_DB.pdf
2007-2013MicrochipTechnologyInc.DS22057B-page1MCP1826/MCP1826SFeatures:•1000mAOutputCurrentCapability•InputOperatingVoltageRan...
2024-12-12508955.35 KB38页220
IC封装资料_电容_CL21B472KCANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1216327.46 MB84页233
IC封装资料_电源管理芯片_MCP1825S-3302E_DB.pdf
©2008MicrochipTechnologyInc.DS22056B-page1MCP1825/MCP1825SFeatures•500mAOutputCurrentCapability•InputOperatingVoltageRange:2.1V...
2024-12-121849733.69 KB38页63
IC封装资料_电容_CC0402CRNPO9BN6R8.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212891.22 MB13页115
IC封装资料_电容_CL10B152KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12630452.9 KB21页81
IC封装资料_电容_GRM1885C1H103JA01D.pdf
GRM1885C1H103JA01_(0603,C0G:EIA,10000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-12797944.09 KB30页43
IC封装资料_电容_CL10B152KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12375259.58 KB3页300
IC封装资料_电容_CL21B473KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216551.45 MB36页218

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