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IC封装资料_电容_0805F183M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124611.05 MB27页227
IC封装资料_电容_CL21C100JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B472KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-126151.45 MB36页17
IC封装资料_电感_YNR5040-680M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12921666.66 KB5页153
IC封装资料_电容_CC0402JRNPO9BN102.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210561.22 MB13页117
IC封装资料_连接器_1843936.pdf
https://www.phoenixcontact.com/us/produkte/184393605.10.2012Page1/6Basestrip-MC1,5/16-GF-3,5-1843936Pleasebeinformedthatthedatasho...
2024-12-121375183.16 KB6页34
IC封装资料_电容_CL21C101JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219441.45 MB36页44
IC封装资料_电感_YNR5040-471M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121723666.66 KB5页114
IC封装资料_连接器_1759075.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12165436.13 MB445页92
IC封装资料_电容_CC0402JRNPO9BN121.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219281.22 MB13页251
IC封装资料_连接器_1844210.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/2-G-3,5OrderNo.:1844210...
2024-12-12612246.93 KB5页60
IC封装资料_电容_GRM1885C1H240JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12972944.07 KB30页86
IC封装资料_电容_CL21C101JCANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213061.45 MB36页205
IC封装资料_连接器_1844249.pdf
https://www.phoenixcontact.com/pi/products/184424904/09/2019Page1/4Feed-throughheader-MC1,5/5-G-3,5-1844249Pleasebeinformedthatthe...
2024-12-121053249.83 KB4页250
IC封装资料_连接器_1844236.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/4-G-3,5OrderNo.:1844236...
2024-12-121032246.82 KB5页157
IC封装资料_连接器_1844223.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/3-G-3,5OrderNo.:1844223...
2024-12-12744246.58 KB5页157
IC封装资料_电容_GRM1885C1H241JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121255944.07 KB30页145
IC封装资料_电容_CL21C102JBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125321.45 MB36页13
IC封装资料_连接器_1844294.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/10-G-3,5OrderNo.:184429...
2024-12-121118246.9 KB5页160
IC封装资料_连接器_1844281.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/9-G-3,5OrderNo.:1844281...
2024-12-121255246.95 KB5页66
IC封装资料_连接器_1844278.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/8-G-3,5OrderNo.:1844278...
2024-12-121294246.95 KB5页47

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