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IC封装资料_电容_CL21C200JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128381.45 MB36页30
IC封装资料_电源管理芯片_MIC5365-1.2YC5-TR.pdf
LP5951VINOUTGNDNCINEnableControl,activehigh13245LoadEN1�F1�FProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&Commu...
2024-12-1211261.31 MB27页267
IC封装资料_连接器_1881516.pdf
https://www.phoenixcontact.com/us/produkte/188151603.10.2012Page1/5Basestrip-MC0.5/9-G-2.5-1881516Pleasebeinformedthatthedatashown...
2024-12-121878181.57 KB5页243
IC封装资料_连接器_1881503.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/8-G-2,5OrderNo.:1881503...
2024-12-121528251.58 KB5页153
IC封装资料_电容_GRM155R71H182KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12894920.26 KB29页265
IC封装资料_电容_GRM1885C1H271JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121318944.07 KB30页151
IC封装资料_电容_CL10B221JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B221JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121929360.94 KB3页37
IC封装资料_电容_CL21C221JCANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-122341.39 MB36页8
IC封装资料_电容_0805F225M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216621.05 MB27页75
IC封装资料_电容_CC0402JRNPO9BN150.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12167517.81 MB176页164
IC封装资料_电感_YNR6045-3R3M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12648672.55 KB6页235
IC封装资料_电感_YNR6045-2R2M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12359672.55 KB6页131
IC封装资料_电容_GRM155R71H183KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12461920.26 KB29页296
IC封装资料_电容_CL10B221KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B221KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219221.45 MB36页263
IC封装资料_连接器_1881545.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/12-G-2,5OrderNo.:188154...
2024-12-121944251.38 KB5页87
IC封装资料_连接器_1881532.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/11-G-2,5OrderNo.:188153...
2024-12-12172251.34 KB5页186
IC封装资料_电容_0805F225Z160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219991.26 MB20页167
IC封装资料_连接器_1881529.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/10-G-2,5OrderNo.:188152...
2024-12-12199251.3 KB5页134
IC封装资料_电感_YNR6045-4R7M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121603672.55 KB6页291
IC封装资料_电容_GRM1885C1H300GA01D.pdf
GRM1885C1H300GA01_(0603,C0G:EIA,30pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121631944.06 KB30页158

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