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IC封装资料_电容_GRM1885C1HR50BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121067944.07 KB30页216
IC封装资料_电源管理芯片_NCP1252ADR2G.pdf
©SemiconductorComponentsIndustries,LLC,2016April,2019−Rev.81PublicationOrderNumber:NCP1252/DNCP1252CurrentModePWMControllerforFo...
2024-12-12621327.95 KB20页196
IC封装资料_电源管理芯片_NCP717.pdf
©SemiconductorComponentsIndustries,LLC,2015February,2015−Rev.71PublicationOrderNumber:NCP717/DNCP717300mA,Very-LowQuiescentCurre...
2024-12-121159629.47 KB16页296
IC封装资料_电容_GRM1885C1H911JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1278944.07 KB30页263
IC封装资料_电容_GRM155R71H821KA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12160610.43 MB296页141
IC封装资料_电容_CL31B475KOHNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1218717.46 MB84页130
IC封装资料_连接器_A2541HWV-19P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121703814.91 KB16页189
IC封装资料_连接器_A2541HWV-22P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121774814.98 KB16页235
IC封装资料_电容_CL10B224KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1217281.45 MB36页136
IC封装资料_连接器_A2541HWV-21P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12437814.91 KB16页241
IC封装资料_连接器_A2541HWV-20P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12492814.89 KB16页231
IC封装资料_电容_0805N120J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210581.26 MB20页26
IC封装资料_电容_GRM1885C1HR60BA01D.pdf
GRM1885C1HR60BA01_(0603,C0G:EIA,0.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121642944.08 KB30页184
IC封装资料_电感_YP0301-6R8M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121704719.3 KB5页281
IC封装资料_电容_GRM1885C1HR50CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12853944.07 KB30页165
IC封装资料_电感_YP0301-4R7M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12463719.3 KB5页50
IC封装资料_电容_CL31C101JCCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121101.39 MB36页118
IC封装资料_电容_CL31B684KBHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B684KBHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215791.47 MB36页37
IC封装资料_电源管理芯片_NCP1271D65R2G.pdf
©SemiconductorComponentsIndustries,LLC,2009September,2009−Rev.61PublicationOrderNumber:NCP1271/DNCP1271Soft-Skip�ModeStandbyPWM...
2024-12-12133317.66 KB21页206
IC封装资料_连接器_A2541HWV-25P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121460815.29 KB16页36

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