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IC封装资料_电容_GRM188C71E225KE11D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12440944.07 KB30页160
IC封装资料_电容_CS0805KKX7R8BB105.pdf
ProductSpecification–June19,2017V.4DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSSoftterminationNPOandX7R16VTO3KV0.47pFto2.2uF...
2024-12-126672.48 MB19页180
IC封装资料_电容_CL10B225KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B225KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210371.45 MB36页198
IC封装资料_电容_CC0402JRNPO9BN470.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1246717.81 MB176页172
IC封装资料_电容_0805N471J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127181.26 MB20页269
IC封装资料_电感_YP0302-151M.pdf
SMDPowerInductors-YP0302Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121881775.67 KB5页116
IC封装资料_电源管理芯片_PAM2306AYPKE.pdf
PAM2306Documentnumber:DS36392Rev.1-21of15www.diodes.comNovember2012©DiodesIncorporatedPAM2306AProductLineofDiodesIncorporatedDUAL...
2024-12-12939649.57 KB15页68
IC封装资料_电容_CL10B271KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121563259.58 KB3页254
IC封装资料_电容_0805N471J251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210841.26 MB20页161
IC封装资料_电感_YP0302-220M.pdf
SMDPowerInductors-YP0302Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121512775.67 KB5页201
IC封装资料_连接器_AFC01-S13H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1214851.58 MB1页186
IC封装资料_电容_GRM1885C2A220JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121780944.07 KB30页283
IC封装资料_电容_GRM188C81E475KE11D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121298944.07 KB30页241
IC封装资料_电容_DE1B3KX681KN4AP01F.pdf
LeadTypeDiscCeramicCapacitors(SafetyStandardCertified)ResinMoldingSMDTypeCeramicCapacitors(SafetyStandardCertified)C85E.pdfSep.14,...
2024-12-1217091.8 MB73页86
IC封装资料_电容_CL10B271KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B271KC8WPNC●Product:Multi-layerCeramicCapacitorCAP,270㎊,100V,±10%,X7R,0603●AEC-Q200Qual...
2024-12-124235.82 MB36页206
IC封装资料_电容_DE1B3KX471KN4AP01F.pdf
TypeKXSafetyStandardCertifiedLeadTypeDiscCeramicCapacitorsforGeneralPurposeReferenceSpecificationProductspecificationsinthiscatalo...
2024-12-121235496.59 KB19页105
IC封装资料_连接器_AFC01-S14FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1212111.85 MB10页255
IC封装资料_电容_GRM1885C2A221JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12344944.07 KB30页225
IC封装资料_电容_0805N471J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129141.26 MB20页97
IC封装资料_电容_DE1E3KX102MA4BP01F.pdf
LeadTypeDiscCeramicCapacitors(SafetyStandardCertified)ResinMoldingSMDTypeCeramicCapacitors(SafetyStandardCertified)C85E.pdfSep.14,...
2024-12-1216821.8 MB73页24

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