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IC封装资料_电容_RVT1C101M0605-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-122051.08 MB3页267
IC封装资料_电容_CL10B472KB8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12378259.58 KB3页131
IC封装资料_电容_1206B331K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217641.05 MB27页284
IC封装资料_电容_ERF0JM681F12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12198415.39 MB230页117
IC封装资料_电感_YP0705-100M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12688721.48 KB5页276
IC封装资料_连接器_1766181.pdf
https://www.phoenixcontact.com/us/products/176618110/24/2014Page1/5Basestrip-GMSTB2,5/8-G-7,62-1766181Pleasebeinformedthatthedatas...
2024-12-121189169.07 KB5页114
IC封装资料_电容_CL10B472KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12707259.57 KB3页280
IC封装资料_电容_1206B331K501NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121851.05 MB27页285
IC封装资料_连接器_BM28B0.6-20DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12337562.52 KB8页287
IC封装资料_电感_YP0705-101M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121869721.48 KB5页55
IC封装资料_连接器_BM28B0.6-18DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121713562.52 KB8页118
IC封装资料_连接器_BM28B0.6-18DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-1251562.52 KB8页3
IC封装资料_连接器_1766194.pdf
https://www.phoenixcontact.com/us/products/176619410/24/2014Page1/5Basestrip-GMSTB2,5/9-G-7,62-1766194Pleasebeinformedthatthedatas...
2024-12-12191168.95 KB5页47
IC封装资料_连接器_BM28B0.6-18DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121478562.52 KB8页49
IC封装资料_电源管理芯片_SP706REN-L_TR.pdf
•www.maxlinear.com•Rev3.0.1SP706R/SP706S/SP706T,SP708S/SP708TDataSheet3.0V/3.3VLowPowerMicroprocessorSupervisoryCircuitsGeneralD...
2024-12-129711.04 MB22页243
IC封装资料_电容_RVT1C102M1010-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-128031.08 MB3页4
IC封装资料_电容_CL10B472KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121804259.58 KB3页10
IC封装资料_电容_1206B332K102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128641.05 MB27页247
IC封装资料_连接器_BM28B0.6-20DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121467562.52 KB8页58
IC封装资料_连接器_BM28B0.6-20DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121741562.52 KB8页270

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