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IC封装资料_电容_CL10B472KB85PNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B472KB85PNL●Product:Multi-layerCeramicCapacitorCAP,4.7㎋,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-128125.88 MB36页266
IC封装资料_连接器_BM28B0.6-34DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12276562.52 KB8页251
IC封装资料_连接器_BM28B0.6-34DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121968562.52 KB8页23
IC封装资料_连接器_BM28B0.6-30DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121836562.52 KB8页55
IC封装资料_电容_RVT1C681M1010-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1216521.08 MB3页98
IC封装资料_电容_1206B333K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211061.05 MB27页57
IC封装资料_电容_ERJ1AM681F16OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12190515.39 MB230页266
IC封装资料_电感_YP0705-221M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121863721.48 KB5页113
IC封装资料_电感_YP0705-220M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121533721.48 KB5页10
IC封装资料_电源管理芯片_SP708EN-L_TR.pdf
SP705/SP706/SP707/SP708/SP813LLowPowerMicroprocessorSupervisoryCircuitsJanuary2020Rev.2.1.11/17Rev.2.1.1GENERALDESCRIPTIONTheSP705...
2024-12-127211.39 MB17页185
IC封装资料_电容_CL10B472KC8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B472KC8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12854405.17 KB3页144
IC封装资料_连接器_BM28B0.6-36DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12204562.52 KB8页269
IC封装资料_连接器_BM28B0.6-34DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12966562.52 KB8页25
IC封装资料_电容_1206B334K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213271.05 MB27页154
IC封装资料_连接器_BM28B0.6-34DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12640562.52 KB8页122
IC封装资料_电容_RVT1E100M0405-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1214901.08 MB3页93
IC封装资料_电源管理芯片_SP708SEN-L_TR.pdf
•www.maxlinear.com•Rev3.0.1SP706R/SP706S/SP706T,SP708S/SP708TDataSheet3.0V/3.3VLowPowerMicroprocessorSupervisoryCircuitsGeneralD...
2024-12-125661.04 MB22页162
IC封装资料_连接器_BM28B0.6-36DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12232562.52 KB8页198
IC封装资料_连接器_BM28B0.6-36DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121414562.52 KB8页44
IC封装资料_电容_GRM188R70J474KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12159944.07 KB30页169

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