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IC封装资料_连接器_BM28B0.6-36DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121412562.52 KB8页44
IC封装资料_电容_GRM188R70J474KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12158944.07 KB30页169
IC封装资料_连接器_BM28B0.6-36DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12595562.52 KB8页61
IC封装资料_电容_CL10B472KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12977259.58 KB3页263
IC封装资料_电容_RVT1E101M0607-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-123821.08 MB3页120
IC封装资料_电容_ERJ1HM221G16OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12157215.39 MB230页99
IC封装资料_电容_1206B392K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213681.05 MB27页248
IC封装资料_电容_1206B391K102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
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IC封装资料_电感_YP0705-330M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121148721.48 KB5页196
IC封装资料_电感_YP0705-222M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121687721.48 KB5页16
IC封装资料_连接器_BM28B0.6-40DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121013562.52 KB8页214
IC封装资料_电源管理芯片_SP4523.pdf
SP4523锂电池充放电SOCV1.3TPOWERSemiconductorhttp://www.tpower-ic.com1概述SP4523是一款集成开关充电和同步升压功能的单芯片解决方案,内...
2024-12-121893479.67 KB5页293
IC封装资料_连接器_BM28B0.6-40DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121405562.52 KB8页26
IC封装资料_电源管理芯片_SP809EK-L-2-9_TR.pdf
SSPP880099//SSPP88110033PPiinnMMiiccrroopprroocceessssoorrSSuuppeerrvviissoorrCCiirrccuuiittNovember2017Rev.2.0.21/8Rev.2.0.2GENER...
2024-12-121849769 KB8页288
IC封装资料_连接器_BM28B0.6-40DP2-0.35V_53_.pdf
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2024-12-121021562.52 KB8页130
IC封装资料_连接器_BM28B0.6-40DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121180562.52 KB8页142
IC封装资料_电容_GRM188R71A105KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121902944.07 KB30页293
IC封装资料_电容_RVT1E220M0405-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-129911.08 MB3页278
IC封装资料_电容_CL10B473JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B473JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121629360.85 KB3页292
IC封装资料_电容_RVT1E102M1213-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-128811.08 MB3页187

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