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IC封装资料_电源管理芯片_TL431BMFDT8R.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-12220278.43 KB28页215
IC封装资料_连接器_DF13E-10DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121026264.15 KB2页279
IC封装资料_连接器_DF12E_5.0_-60DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12118288.67 KB11页104
IC封装资料_电容_GRM188R71E104MA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121427944.07 KB30页202
IC封装资料_电容_F971C106MAA.pdf
108071119F97SeriesResin-MoldedChip,ImprovedReliabilityJ-LeadLEAD-FREECOMPATIBLECOMPONENTLHSW1W2SLHSW1W2SA,BCASEC,NCASEF97Type1CRat...
2024-12-121024334.34 KB5页126
IC封装资料_电容_CL10B562KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121144259.58 KB3页175
IC封装资料_连接器_DF13E-40DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121794264.15 KB2页294
IC封装资料_连接器_DF13E-30DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121524264.15 KB2页54
IC封装资料_电容_FC0H224ZFTBR24.pdf
1©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comS6011_FC•3/29/2017Oneworld.OneKEMETBe...
2024-12-121806867.01 KB16页70
IC封装资料_电容_CL10B562JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B562JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121425360.96 KB3页56
IC封装资料_电容_CL10B561KC8WPNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12522452.9 KB21页92
IC封装资料_连接器_DMR-9P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12622347.49 KB1页172
IC封装资料_连接器_DM3AT-SF-PEJM5.pdf
12017.1③microSD™CardConnectorsDM3Series■Features◆CommontotheentireSeries1.ExtremelysmallinsizeSmallexternaldimensionsandtheabo...
2024-12-12406864.7 KB13页229
IC封装资料_电容_1206CG5R0C102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217511.05 MB27页90
IC封装资料_连接器_DF57H-2P-1.2V_21_.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121481514.22 KB3页85
IC封装资料_连接器_DF40C-30DS-0_4V_51_.pdf
10.4mmPitch,1.5to4.0mmHeight,Board-to-BoardandBoard-to-FPCConnectorsDF40Series2013.11④■Features1.HighdensitymountingSpacesavingd...
2024-12-1210391.01 MB21页287
IC封装资料_电感_YPRH105R-470M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12549765.25 KB5页183
IC封装资料_电容_SPZ1AM561E10O00RAXXX.pdf
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2024-12-1258715.39 MB230页210
IC封装资料_电感_YPRH105R-331M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121484765.25 KB5页17
IC封装资料_电源管理芯片_TL431BMFDTVL.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-12622278.43 KB28页297

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