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IC封装资料_电源管理芯片_TLC5926QPWPRQ1.pdf
OUT0OUT15VDDSDOR-EXTGNDSDICLKLEOEVLEDVDD:3.0Vto5.5VSDICLKLEOETLC5926/TLC5927-Q1ControllerToControllerifErrorDetectionUsedProductFo...
2024-12-1218351.81 MB37页169
IC封装资料_连接器_FH12-8S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121517339.76 KB6页51
IC封装资料_连接器_FH12-7S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12991339.76 KB6页225
IC封装资料_电容_T491A225K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-124011.54 MB23页163
IC封装资料_电容_GRM188R71H104JA93D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121090944.07 KB30页142
IC封装资料_电容_CL10B683KA85PNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B683KA85PNCProduct:Multi-layerCeramicCapacitorDescription:CAP,68㎋,25V,±1...
2024-12-121438227.62 KB2页273
IC封装资料_电容_GCJ21BR71E334KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-121315.94 MB73页75
IC封装资料_电容_CL10B683KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121717361.46 KB3页115
IC封装资料_连接器_FH12-16S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12690339.76 KB6页288
IC封装资料_电容_1206CG120J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219261.05 MB27页106
IC封装资料_连接器_FH12-12S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121016339.76 KB6页64
IC封装资料_连接器_FH12-11S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12989339.76 KB6页231
IC封装资料_电感_YPRH1204-6R8M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121843735.47 KB5页257
IC封装资料_电源管理芯片_TLC5941PWPR.pdf
PWPRHBNT1FEATURESAPPLICATIONSDESCRIPTIONDelayx06−Bit�Dot�Correction12−Bit�GrayscalePWM�ControlDC�RegisterGS�RegisterConsta...
2024-12-124722.48 MB36页206
IC封装资料_电容_T491A226K010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1214611.54 MB23页137
IC封装资料_电容_T491A226K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1210781.54 MB23页42
IC封装资料_连接器_FH28-10S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-12899492.73 KB12页242
IC封装资料_电容_GRM188R71H104KA93D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121443944.07 KB30页111
IC封装资料_电容_CL10B683KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-126921.45 MB36页141
IC封装资料_连接器_FH12-26S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12337339.76 KB6页266

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