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IC封装资料_电容_CL10C4R7CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12563259.58 KB3页198
IC封装资料_电容_CL10C4R7BB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121320316.22 KB3页194
IC封装资料_电容_TAJB107M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121271210.32 KB7页45
IC封装资料_电容_TAJB107M002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121821210.32 KB7页113
IC封装资料_电容_1206X226M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219061.05 MB27页215
IC封装资料_电容_GCJ188R72A152KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214474.17 MB96页224
IC封装资料_逻辑及时序器件_SN74AC244DWR.pdf
SN54AC244,SN74AC244OCTALBUFFERS/DRIVERSWITH3-STATEOUTPUTSSCAS514E−JUNE1995−REVISEDOCTOBER20031POSTOFFICEBOX655303•DALLAS,TEXAS7...
2024-12-124621.56 MB24页6
IC封装资料_电感_YSPI0530-220M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121489698.99 KB4页164
IC封装资料_电容_TAJB107M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12513210.32 KB7页43
IC封装资料_电源管理芯片_TPS3839G18DQNR.pdf
100110120130140150160170180190200−40−1510356085Temperature(°C)SupplyCurrent(nA)VDD=1.2VVDD=3.3VVDD=5.0VVDD=6.5VG001VDDRESETGNDT...
2024-12-129611.48 MB34页28
IC封装资料_电容_GRM188R72E102KW07D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12447944.07 KB30页154
IC封装资料_电容_GCJ188R72A223KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1219644.17 MB96页189
IC封装资料_电容_CL10C4R7CC81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12964452.9 KB21页270
IC封装资料_逻辑及时序器件_SN74LVC1G07DCKR.pdf
AYProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatasheetaddressesavailab...
2024-12-1211632.59 MB41页142
IC封装资料_电容_1206X475K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121531.05 MB27页152
IC封装资料_电容_TAJB154M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12486210.32 KB7页293
IC封装资料_电容_1206X226M160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216631.05 MB27页137
IC封装资料_电容_TAJB154K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121110210.32 KB7页150
IC封装资料_嵌入式微处理器_APM32F030K6T6.pdf
APM32F030x6/x8基于Arm®Cortex®-M0+内核的32位微控制器版本：V1.1数据手册Datasheet更多资料下载请到五八文库wk.58sms.com产品特性系统...
2024-12-126192.29 MB62页94
IC封装资料_电感_YSPI0530-R68M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121803698.99 KB4页201

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