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IC封装资料_电源管理芯片_LT3502AEMS_TRPBF.pdf
LT3502/LT3502A13502fdFeaturesapplicationsDescription1.1MHz/2.2MHz,500mAStep-DownRegulatorsin2mm×2mmDFNandMS10TheLT®3502/LT3502Aa...
2024-12-121396543.36 KB24页280
IC封装资料_电源管理芯片_LTC3422EDD_TRPBF.pdf
LTC342213422fa■WirelessHandsets■HandheldComputers■GPSReceivers■MP3Players■700mAContinuous/1APulsedOutputCurrentforLi-Ionto5VA...
2024-12-121276336.5 KB16页280
IC封装资料_电容_CC1206KKX7RZBB223.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121134998.46 KB11页280
IC封装资料_电容_0805B102K251NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216861.05 MB27页280
IC封装资料_电源管理芯片_LTC1624CS8_PBF.pdf
1LTC1624FEATURESDESCRIPTIONUIN-ChannelMOSFETDriveIImplementsBoost,Step-Down,SEPICandInvertingRegulatorsIWideVINRange:3.5Vto36VOper...
2024-12-121788486.85 KB28页280
IC封装资料_电感_SWPA5040S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215301.32 MB22页280
IC封装资料_电源管理芯片_LTC3878EGN_TRPBF.pdf
LTC38783878faTypicalapplicaTionFeaTuresapplicaTionsDescripTionFast,WideOperatingRangeNoRSENSEStep-DownDC/DCControllernDistributedP...
2024-12-12237487.08 KB26页280
IC封装资料_电容_CL10A475KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A475KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1215991.42 MB36页280
IC封装资料_连接器_1804852.pdf
https://www.phoenixcontact.com/us/produkte/180485219.10.2012Page1/7Basestrip-PC4/8-G-7,62-1804852Pleasebeinformedthatthedatashowni...
2024-12-121859210.37 KB7页280
IC封装资料_电感_SWPA252012S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211871.32 MB22页280
IC封装资料_电容_CL10CR75BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121001259.58 KB3页280
IC封装资料_电感_WPN4020H1R5MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121911624.92 KB9页280
IC封装资料_电容_CL10B104JO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104JO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121419361.09 KB3页280
IC封装资料_电容_CL10B104KA8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B104KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,100㎋,25V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1211085.81 MB36页280
IC封装资料_电容_GRM1885C1H2R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121624944.07 KB30页280
IC封装资料_电感_YNR5020-3R3M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121359664.7 KB5页280
IC封装资料_连接器_1843253.pdf
https://www.phoenixcontact.com/us/produkte/184325302.11.2012Page1/6Basestrip-MCV1.5/5-GF-3.5-1843253Pleasebeinformedthatthedatasho...
2024-12-121508239.57 KB6页280
IC封装资料_连接器_A0801AWR-24-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12593334.91 KB1页280
IC封装资料_电容_CC0402JRNPO9BN221.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1231917.81 MB176页280
IC封装资料_电源管理芯片_RS3002-3_3YE3L.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-121879660.04 KB15页280

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