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IC封装资料_电容_CL10B103KB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121328259.58 KB3页274
IC封装资料_电容_GRM1555C1H471GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12347920.26 KB29页274
IC封装资料_电容_GRM1555C1HR30BA01D.pdf
GRM1555C1HR30BA01_(0402,C0G:EIA,0.3pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12706944.32 KB30页274
IC封装资料_电感_YNR2510-1R0M.pdf
SMDPowerInductors-YNR2510Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121284657.99 KB4页274
IC封装资料_连接器_2510S-4P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12627667.33 KB1页274
IC封装资料_电容_CC0402BRNPO9BN2R2.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12131998.46 KB11页274
IC封装资料_电容_CL21A476MQCLRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219781.45 MB36页274
IC封装资料_电容_GRM1885C1H8R2CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12645944.07 KB30页274
IC封装资料_电容_0805CG360J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122731.05 MB27页274
IC封装资料_电感_YNR5040-101M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12594666.66 KB5页274
IC封装资料_连接器_1843907.pdf
https://www.phoenixcontact.com/us/products/184390710/28/2014Page1/5Basestrip-MC1,5/13-GF-3,5-1843907Pleasebeinformedthatthedatasho...
2024-12-121094175.34 KB5页274
IC封装资料_电源管理芯片_STM6519.pdf
Thisisinformationonaproductinfullproduction.June2016DocID022111Rev71/23STM6519Single-pin,pushbuttonSmartReset™Datasheet-productio...
2024-12-121300641.16 KB23页274
IC封装资料_电容_T490A107M006ATE800.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-125341.54 MB23页274
IC封装资料_电容_CL10B682KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121031259.58 KB3页274
IC封装资料_电容_T491D106M050AT.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardT2005_T491•8/20/2018FortLauderdale,FL33301USA•954-766-2800•w...
2024-12-124671.47 MB23页274
IC封装资料_连接器_SM08B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121832661 KB4页274
IC封装资料_电容_GCJ216R71H222KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-121354.17 MB96页274
IC封装资料_电容_CL10C030BB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121259339.99 KB3页274
IC封装资料_电源管理芯片_TPS55010RTER.pdf
PHVINGNDBOOTVSENSECOMPTPS55010ENRT/CLKSSFAULTCssRtCCCbootT1CIN3Vto5.5V+VO_1:2.5COCPRIRLSRHS5V200mARC01020304050607080901000.000.05...
2024-12-123752.29 MB46页274
IC封装资料_电源管理芯片_TPS57112QRTERQ1.pdf
PHVINThermalPadBOOTVSENSECOMPTPS57112-Q1ENRT/CLKSS/TRPWRGDC(SS)RtR3C1C(BOOT)C(O)R1R2C(I)VOV(VIN)AGNDGNDR4R5L(O)Efficiency(%)Output...
2024-12-1214461.89 MB45页274

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