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IC封装资料_电源管理芯片_DC-005_5_5-2_0MM.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121665766.85 KB1页270
IC封装资料_连接器_1717732.pdf
https://www.phoenixcontact.com/us/produkte/171773219.10.2012Page1/5PCBterminalblock-GMKDS1,5/3-7,62-1717732Pleasebeinformedthatthe...
2024-12-121399170.65 KB5页270
IC封装资料_电感_CLF7045NIT-3R3N-D.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12844308.52 KB5页270
IC封装资料_传感器_SHT35A-DIS-B10kS.pdf
www.sensirion.comFebruary2019-Version61/22DatasheetSHT3x-DISHumidityandTemperatureSensorFullycalibrated,linearized,andtemperatur...
2024-12-1219061010.72 KB22页270
IC封装资料_电容_0402CG680J250NT.pdf
IC封装资料_电容_0402CG680J250NT.pdf
2024-12-12190673.25 KB1页270
IC资料_T18-2VNLPC-Q8 (BANNER).pdf
DatasheetNextGenerationofSelf-Containeddc-OperatedSensors•Completefamilyofsensors,allhousedinthecompactrightangle18mmthreadedhous...
2024-12-151066771.82 KB10页270
IC封装资料_电容_CC0402CRNPO9BN4R7.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12117617.81 MB176页270
IC封装资料_连接器_1-292133-3.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12745222.7 KB2页270
IC封装资料_电容_CL10B104KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1218971.45 MB36页270
IC封装资料_电感_WPN252010H3R3MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121527624.92 KB9页270
IC封装资料_电容_CL10C681JA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12650316.29 KB3页270
IC封装资料_电容_GRM1555C1H120JZ01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12166810.43 MB296页270
IC封装资料_电容_CL10C390JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121620316.3 KB3页270
IC封装资料_电源管理芯片_XL7025.pdf
Datasheet0.6A150KHz80VBuckDCtoDCConverterXL7025Rev1.0www.xlsemi.com1Features�Wide10Vto80VOperationVoltage�OutputAdjustablefrom1....
2024-12-121531345.66 KB10页270
IC封装资料_电感_SWPA6045S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125761.32 MB22页270
IC封装资料_电源管理芯片_LTC3890IGN-1_PBF.pdf
LTC3890-1138901fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION60VLowIQ,Dual,2-PhaseSynchronousStep-DownDC/DCControllerHighEffi...
2024-12-121214955.88 KB36页270
IC封装资料_电感_SWPA3015S1R5MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122671.32 MB22页270
IC封装资料_电容_0603F393M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216891.05 MB27页270
IC封装资料_电容_0603F333M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124501.05 MB27页270
IC封装资料_电容_CC1206ZKY5V7BB106.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-123371.08 MB13页270

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