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IC封装资料_电容_GRM188R61A224KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121984944.07 KB30页269
IC封装资料_电容_0805N471J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127181.26 MB20页269
IC封装资料_电容_0805N330J501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124491.26 MB20页269
IC封装资料_电容_GRM155R71H271KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121452920.26 KB29页269
IC封装资料_电容_0805F225M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125781.05 MB27页269
IC封装资料_电容_GRM1885C1H161JA01D.pdf
GRM1885C1H161JA01_(0603,C0G:EIA,160pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12383944.12 KB30页269
IC封装资料_电容_GRM155R71E153KA61D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12747920.26 KB29页269
IC封装资料_电容_CC0402CRNPO9BN3R3.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125251.22 MB13页269
IC封装资料_电容_0805CG200G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215161.05 MB27页269
IC封装资料_电源管理芯片_LTM4623IY_PBF.pdf
LTM46231RevDFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTIONUltrathin20VIN,3AStep-DownDC/DCµ...
2024-12-12970382.01 KB28页269
IC封装资料_电容_CL21A106MQFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1210027.46 MB84页269
IC封装资料_电容_GRM1555C1H390JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121183920.26 KB29页269
IC封装资料_电容_CL10C471JE8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12442316.34 KB3页269
IC封装资料_连接器_1804849.pdf
https://www.phoenixcontact.com/us/produkte/180484919.10.2012Page1/7Basestrip-PC4/7-G-7,62-1804849Pleasebeinformedthatthedatashowni...
2024-12-121674210.39 KB7页269
IC封装资料_电感_SWPA6020S1R5NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211941.32 MB22页269
IC封装资料_电感_SDFL1608T270KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121442457.75 KB7页269
IC封装资料_连接器_1751316.pdf
https://www.phoenixcontact.com/us/produkte/175131602.11.2012Page1/6PCBterminalblock-MKDS1/9-3,5-1751316Pleasebeinformedthatthedata...
2024-12-12858175.46 KB6页269
IC封装资料_电感_NLCV25T-3R3M-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121549249.79 KB16页269
IC封装资料_电容_0603B501K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214281.05 MB27页269
IC封装资料_电容_0402CG390J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129441.05 MB27页269

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