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IC封装资料_数据转换器_AD5668BCPZ-2500RL7.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1219581.04 MB30页262
IC封装资料_电容_CL10C222JA8NNNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121974452.9 KB21页262
IC封装资料_三极管_IRLML6401TRPBF.pdf
ParameterTyp.Max.UnitsRθJAMaximumJunction-to-Ambient�75100��HEXFET��PowerMOSFETThermalResistanceVDSS=-12VRDS(on)=0.05ΩP...
2024-12-12253291.26 KB9页262
IC封装资料_电容_AC0603KRX7R9BB223.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-126031.81 MB24页262
IC封装资料_电容_TAJD156K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12898208.62 KB7页262
IC封装资料_电源管理芯片_TPS54302DDCR.pdf
OutputCurrent(A)Efficiency(%)01020304050607080901000.0010.010.11D100VIN=12V,VOUT=5VVIN=12V,VOUT=3.3VVIN=24V,VOUT=5VVIN=24V,VOUT=3....
2024-12-128901.79 MB28页262
IC封装资料_电感_YSPI1040-3R3M.pdf
SMDPowerInductors-YSPI1040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12509702.46 KB5页262
IC封装资料_电容_TAJC227M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121582210.32 KB7页262
IC封装资料_电感_YSPI0750-1R0M.pdf
SMDPowerInductors-YSPI0750Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-121609700.46 KB5页262
IC封装资料_电容_T491B335K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-126871.54 MB23页262
IC封装资料_连接器_DF12E_5.0_-36DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121810288.67 KB11页262
IC封装资料_连接器_DF12C-60DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121683288.67 KB11页262
IC封装资料_电容_ERR1KM010D110T.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1214815.39 MB230页262
IC封装资料_电容_1206B475K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128171.05 MB27页262
IC封装资料_电感_YP1005-221M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12741776.32 KB5页262
IC封装资料_电容_CL10B473KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121540452.9 KB21页262
IC封装资料_电容_CL10B333JB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333JB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121476360.62 KB3页262
IC封装资料_电容_GRM188R60J106ME47J.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1226010.43 MB296页262
IC封装资料_电容_CC0402JRNPO9BN300.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12130017.81 MB176页262
日立L32-H03W液晶电视维修手册_hitachi_L32-H03W.pdf
Caution:Besuretoreadthismanualbeforeservicing.Toensuresafetyfromfire,electricshock,injury,harmfulradiationandmaterials,variousmeas...
2024-09-269515.06 MB49页262

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