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IC封装资料_电容_0805B182K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126091.05 MB27页233
IC封装资料_电容_CL10A106MR5LQNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121326259.58 KB3页233
IC封装资料_电容_CL10A225KP8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KP8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-123891.42 MB36页233
IC封装资料_电容_C1808V104KBRACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1034_X7R_HV_ARC_SMD•11/9/2018FortLauderdale,FL33301USA•954-7...
2024-12-126131.57 MB23页233
IC封装资料_电容_GRM155R61C225ME44D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12567920.26 KB29页233
IC封装资料_接口及驱动芯片_ISO1042BQDWVRQ1.pdf
1243765TXDVCC1RXDGND1CANHCANL8VCC2MCURXDTXDVDDDGNDDigitalGroundISOGroundCANBusGalvanicIsolationBarrierISO1042-Q1GND2VCC1VCC2Produc...
2024-12-127063.07 MB43页233
IC封装资料_电容_CC0201JRNPO8BN270.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219211.22 MB13页233
IC封装资料_电源管理芯片_MC7815BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-121121296.53 KB31页233
IC封装资料_电容_CL21B472KCANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1216327.46 MB84页233
IC封装资料_电容_1206B223K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216691.05 MB27页233
IC封装资料_电感_YP1005-150M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121708776.32 KB5页233
IC封装资料_电容_TAJA226K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121204210.32 KB7页233
IC封装资料_电容_1210B104K251NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125731.05 MB27页233
IC封装资料_电感_YSPI0750-100M.pdf
SMDPowerInductors-YSPI0750Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12412700.46 KB5页233
IC封装资料_电容_TAJD157M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12615210.32 KB7页233
IC封装资料_电容_TAJD225K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12293210.32 KB7页233
IC封装资料_电容_TAJE477M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121199210.32 KB7页233
IC封装资料_电容_CL10C101JC81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C101JC81PNC●Product:Multi-layerCeramicCapacitorCAP,100㎊,100V,±5%,C0G,0603●AEC-Q200Quali...
2024-12-1219485.8 MB36页233
IC封装资料_三极管_NX7002AKVL.pdf
NX7002AK60V,singleN-channelTrenchMOSFET6August2015Productdatasheet1.GeneraldescriptionN-channelenhancementmodeField-EffectTransist...
2024-12-12196809.44 KB17页233
IC封装资料_电源管理芯片_XC6701B502MR-G.pdf
1/35XC6701Series28VOperationHighSpeedVoltageRegulatorswithStand-byFunction■FEATURESMaxOutputCurrent:Morethan150mA(200mAlimit)(VIN...
2024-12-12964753.36 KB35页233

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