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IC封装资料_电容_GJM1555C1HR60WB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1294110.43 MB296页231
IC封装资料_电感_SWPA6028S180MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211871.32 MB22页231
IC封装资料_电容_0805B222K501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-12511.26 MB20页231
IC封装资料_电容_CL10C332JA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121995316.41 KB3页231
IC封装资料_二极管_1PS79SB31.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-121717344.79 KB8页231
IC封装资料_电容_GRM1555C1H240JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121331920.26 KB29页231
IC封装资料_电容_GRM1555C1H821JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121845920.26 KB29页231
IC封装资料_电感_WPN252012H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121039624.92 KB9页231
IC封装资料_连接器_1.25T-9A.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12865273.91 KB1页231
IC封装资料_电容_GRM1555C1HR80WA01D.pdf
GRM1555C1HR80WA01_(0402,C0G:EIA,0.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121245944.44 KB30页231
IC封装资料_电容_GRM155R71A683KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121787920.26 KB29页231
IC封装资料_电源管理芯片_LTM8025EV_PBF.pdf
LTM80251Rev.DFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION36V,3AStep-DownµMod...
2024-12-122181.47 MB22页231
IC封装资料_电容_GRM1885C1H2R7CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121854944.07 KB30页231
IC封装资料_电容_GRM1885C1H2R7BA01D.pdf
GRM1885C1H2R7BA01_(0603,C0G:EIA,2.7pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12756944.1 KB30页231
IC封装资料_电容_CL10B222JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B222JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121529360.96 KB3页231
IC封装资料_连接器_A0801AWR-03-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-1299334.91 KB1页231
IC封装资料_电容_CL31A107MPHNNNE.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12549452.9 KB21页231
IC封装资料_连接器_A2541HWV-20P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12492814.89 KB16页231
IC封装资料_电容_GRM1885C2A121JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12276944.07 KB30页231
IC封装资料_电源管理芯片_REF3020AIDBZR.pdf
REF3012REF3020REF3025REF3030REF3033REF3040SBVS032F–MARCH2002–REVISEDAUGUST2008DESCRIPTIONTheREF30xxisaprecision,lowpower,lowvolt...
2024-12-12833718.95 KB17页231

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