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IC封装资料_电容_0805B332K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129941.26 MB20页228
IC封装资料_电容_CC0201JRNPO9BN200.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121076998.46 KB11页228
IC封装资料_电容_CC0201JRNPO9BN560.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126021.22 MB13页228
IC封装资料_电容_CL21B104KCFWPNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121357.55 MB84页228
IC封装资料_连接器_1888690.pdf
https://www.phoenixcontact.com/us/produkte/188869021.12.2012Page1/6PCBterminalblock-MKDSN2.5/3-5.08-1888690Pleasebeinformedthatthe...
2024-12-12893198.32 KB6页228
IC封装资料_电容_CL10B221KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12566259.58 KB3页228
IC封装资料_连接器_A2001WV-S-3P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-121416404 KB6页228
IC封装资料_电容_CL31B104KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31F334ZBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-127691.45 MB36页228
IC封装资料_电容_CL10B224KO8SFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KO8SFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215171.45 MB36页228
IC封装资料_电源管理芯片_PAM2301CAABADJ.pdf
PAM2301Documentnumber:DS36384Rev.3-21of13www.diodes.comFebruary2018©DiodesIncorporatedPAM2301NEWPRODUCT800mASTEP-DOWNDC-DCCONVERT...
2024-12-125411.15 MB13页228
IC封装资料_电容_GRM1885C2A330JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121180944.07 KB30页228
IC封装资料_电感_YP0402-100M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12814771.92 KB4页228
IC封装资料_电容_GRM188R61A225KE34D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12257944.07 KB30页228
IC封装资料_连接器_BM28B0.6-18DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121019562.52 KB8页228
IC封装资料_连接器_DF12B_3.5_-20DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121446288.67 KB11页228
IC封装资料_电容_1206B563K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129411.05 MB27页228
IC封装资料_连接器_F0502-B-59-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-121570290.85 KB1页228
IC封装资料_电容_GCJ21BR71H223KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-124005.94 MB73页228
IC封装资料_电容_CL10C1R8CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121555259.58 KB3页228
IC封装资料_电感_YSPI0420-3R3M.pdf
SMDPowerInductors-YSPI0420Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121372700.01 KB4页228

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