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IC封装资料_电容_C1005X5R1E225K050BC.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-121871.65 MB57页227
IC封装资料_电感_SWPA252012S2R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125601.32 MB22页67
IC封装资料_二极管_MMSZ5225BT1G.pdf
©SemiconductorComponentsIndustries,LLC,2015May,2019−Rev.151PublicationOrderNumber:MMSZ5221BT1/DMMSZ52xxxT1GSeries,SZMMSZ52xxxT1G...
2024-12-12825253.45 KB7页51
IC封装资料_二极管_GBJ2508-F.pdf
GBJ25005-GBJ2510OrderingInformation(Note6)PartNumberCasePackagingGBJ25005-FGBJ15/TubeGBJ2501-FGBJ15/TubeGBJ2502-FGBJ15/TubeGBJ2504...
2024-12-12528163.02 KB1页289
IC封装资料_电感_SWPA252012S1R5MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122101.32 MB22页110
IC封装资料_电容_GRM1555C1H200JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121383920.26 KB29页206
IC封装资料_电源管理芯片_LTC4353CMS_PBF.pdf
LTC435314353fTypicalapplicaTionFeaTuresDescripTionDualLowVoltageIdealDiodeControllerTheLTC®4353controlsexternalN-channelMOSFETsto...
2024-12-121239325.02 KB16页299
IC封装资料_电容_CL10C621JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12867259.58 KB3页13
IC封装资料_电容_CL10C620JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12616316.27 KB3页171
IC封装资料_电源管理芯片_LTC4352IMS_TRPBF.pdf
LTC435214352faTypicalapplicaTionDescripTionLowVoltageIdealDiodeControllerwithMonitoringTheLTC®4352createsanear-idealdiodeusingane...
2024-12-12992307.26 KB16页40
IC封装资料_电容_C1005X7R104KETS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-128351.92 MB48页116
IC封装资料_电容_GRM155R61A475MEAAD.pdf
GRM155R61A475MEAA_(0402,X5R:EIA,4.7uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12684944.57 KB30页133
IC封装资料_二极管_NSR0230P2T5G.pdf
©SemiconductorComponentsIndustries,LLC,2013September,2019−Rev.31PublicationOrderNumber:NSR0230P2/DSchottkyBarrierDiodeNSR0230P2T...
2024-12-12719316.9 KB4页275
IC封装资料_电容_CL10B102KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121672452.9 KB21页9
IC封装资料_电容_GRM1555C1H220FA01D.pdf
GRM1555C1H220FA01_(0402,C0G:EIA,22pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12325947.48 KB30页293
IC封装资料_电容_CL10B102KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121968334.92 KB3页296
IC封装资料_电容_CL10C680GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12781316.17 KB3页235
IC封装资料_电容_CL10C680FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121322259.57 KB3页85
IC封装资料_电容_0805B474K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121271.05 MB27页11
IC封装资料_电容_C1005X7R223KFTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1211441.92 MB48页281

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