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IC封装资料_电源管理芯片_LTC6803HG-3_TRPBF.pdf
LTC6803-1/LTC6803-31680313faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-121145504.73 KB40页293
IC封装资料_电容_GRM1555C1H820JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121735920.26 KB29页276
IC封装资料_电源管理芯片_LTC6803HG-3_PBF.pdf
LTC6803-1/LTC6803-31680313faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-12120504.73 KB40页117
IC封装资料_电容_CL10Y104MR5NJNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y104MR5NJNCProduct:Multi-layerCeramicCapacitor...
2024-12-12202264.26 KB3页267
IC封装资料_电容_CL10X475MQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121355259.58 KB3页116
IC封装资料_电容_CL10B104JO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12316259.58 KB3页80
IC封装资料_电容_CC0201CRNPO9BN3R3.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12661998.46 KB11页156
IC封装资料_电容_0805CG5R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129821.05 MB27页188
IC封装资料_电容_CC0201CRNPO9BN2R7.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121139998.46 KB11页198
IC封装资料_连接器_0.5K-DX-20PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121659453.69 KB1页24
IC封装资料_电感_WPN252012H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12241624.92 KB9页147
IC封装资料_连接器_0.5K-DX-18PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121495453.69 KB1页83
IC封装资料_电源管理芯片_LTC6803HG-4_PBF.pdf
LTC6803-2/LTC6803-41680324faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-121685486.53 KB40页133
IC封装资料_电容_GRM1555C1H821JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121845920.26 KB29页231
IC封装资料_电容_GRM155R61E474KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121510920.26 KB29页289
IC封装资料_电容_CL10Y105MR5NJNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12211259.58 KB3页251
IC封装资料_电容_CL10Y104MR5NJND.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y104MR5NJNDProduct:Multi-layerCeramicCapacitor...
2024-12-12755276 KB3页15
IC封装资料_电容_CL10B104JO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104JO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121419361.09 KB3页280
IC封装资料_电容_CC0201CRNPO9BN3R9.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121986998.46 KB11页247
IC封装资料_电容_0805CG5R1C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128131.05 MB27页156

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