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IC封装资料_电容_GRM1885C1H2R7CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121854944.07 KB30页231
IC封装资料_电源管理芯片_MAX705CSA_T.pdf
GeneralDescriptionTheMAX705–MAX708/MAX813Lmicroprocessor(µP)supervisorycircuitsreducethecomplexityandnumberofcomponentsrequiredt...
2024-12-1214891.39 MB12页252
IC封装资料_电容_GRM1885C1H2R7BA01D.pdf
GRM1885C1H2R7BA01_(0603,C0G:EIA,2.7pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12756944.1 KB30页231
IC封装资料_电容_CC0402BRNPO9BNR75.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125081.22 MB13页41
IC封装资料_电容_GRM155R71C183KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121582920.26 KB29页153
IC封装资料_电容_CC0402BRNPO9BNR68.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12659998.46 KB11页76
IC封装资料_电容_CL10B105KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12160259.58 KB3页87
IC封装资料_电容_CC0402BRNPO9BNR80.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121893998.46 KB11页266
IC封装资料_电容_CL10B105KA8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12271259.58 KB3页21
IC封装资料_电容_GRM1885C1H3R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12151944.07 KB30页223
IC封装资料_电容_0805CG200J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213851.05 MB27页145
IC封装资料_电容_GRM1885C1H3R0BA01D.pdf
GRM1885C1H3R0BA01_(0603,C0G:EIA,3pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12844944.09 KB30页203
IC封装资料_电感_YNR3015-151M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121331665.41 KB5页61
IC封装资料_电容_CL21A226MQCLRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A226MQCLRNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218291.48 MB36页176
IC封装资料_电容_CL21A226MPQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1219181.42 MB36页188
IC封装资料_连接器_1759033.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12175236.13 MB445页286
IC封装资料_连接器_1830606.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12123536.13 MB445页265
IC封装资料_电容_GRM1885C1H3R3BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12938944.07 KB30页219
IC封装资料_电容_GRM155R71C223KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121715920.26 KB29页300
IC封装资料_电容_CL21A226MQQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213281.42 MB36页159

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