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IC封装资料_电容_GRM1885C1H5R6CA01D.pdf
GRM1885C1H5R6CA01_(0603,C0G:EIA,5.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12997944.1 KB30页181
IC封装资料_电感_YNR4018-151M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121892661.38 KB5页44
IC封装资料_电容_GRM1885C1H6R0CA01D.pdf
GRM1885C1H6R0CA01_(0603,C0G:EIA,6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121617944.1 KB30页48
IC封装资料_电源管理芯片_MAX14921ECS_.pdf
MAX14920/MAX14921High-Accuracy12-/16-CellMeasurementAFEs19-6496;Rev3;3/15OrderingInformationappearsatendofdatasheet.FunctionalDiag...
2024-12-1219001.11 MB30页2
IC封装资料_电容_GRM1885C1H5R6DA01D.pdf
GRM1885C1H5R6DA01_(0603,C0G:EIA,5.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121628944.06 KB30页265
IC封装资料_电容_CC0402CRNPO9BN2R0.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1285617.81 MB176页259
IC封装资料_电容_GRM155R71C472KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121189920.26 KB29页291
IC封装资料_电容_CL10B105KP8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KP8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219821.45 MB36页160
IC封装资料_电容_0805CG270J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128151.05 MB27页220
IC封装资料_电感_YNR4018-330M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12188661.38 KB5页166
IC封装资料_电容_GRM1885C1H6R0DA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12849944.07 KB30页7
IC封装资料_连接器_1830664.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-128236.13 MB445页91
IC封装资料_电感_YNR4018-220M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12572661.38 KB5页2
IC封装资料_连接器_1759046.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-129136.13 MB445页261
IC封装资料_电容_GRM1885C1H6R2BA01D.pdf
GRM1885C1H6R2BA01_(0603,C0G:EIA,6.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12439944.1 KB30页123
IC封装资料_电容_GRM1885C1H6R2CA01D.pdf
GRM1885C1H6R2CA01_(0603,C0G:EIA,6.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12850944.1 KB30页248
IC封装资料_电容_CL21B104KCFWPNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121357.55 MB84页228
IC封装资料_电源管理芯片_MAX17225ELT+T.pdf
GeneralDescriptionTheMAX17220–MAX17225isafamilyofultra-lowquiescentcurrentboost(step-up)DC-DCconverterswitha225mA/0.5A/1Apeakindu...
2024-12-121890992.67 KB23页91
IC封装资料_电容_GRM1885C1H6R8BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12622944.07 KB30页293
IC封装资料_电容_GRM155R71C473KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12868920.26 KB29页17

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