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IC封装资料_电容_GRM1885C1H9R0CA01D.pdf
GRM1885C1H9R0CA01_(0603,C0G:EIA,9pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12260944.11 KB30页81
IC封装资料_电容_CL21B224KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B224KOFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-121566361.01 KB3页255
IC封装资料_电容_GRM155R71E104KE14D.pdf
GRM155R71E104KE14_(0402,X7R:EIA,0.1uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121329924.52 KB29页146
IC封装资料_电容_CL21B224KOCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213791.45 MB36页90
IC封装资料_电容_CC0402CRNPO9BN2R7.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1279217.81 MB176页263
IC封装资料_电容_CL10B122KB8WPNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121592452.9 KB21页66
IC封装资料_电容_CL10B122KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121301452.9 KB21页268
IC封装资料_电容_0805CG391J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127631.05 MB27页109
IC封装资料_电感_YNR4030-220M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121052664.95 KB5页135
IC封装资料_电容_GRM1885C1H9R1BA01D.pdf
GRM1885C1H9R1BA01_(0603,C0G:EIA,9.1pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121682944.08 KB30页25
IC封装资料_电感_YNR4030-151M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121263664.95 KB5页105
IC封装资料_电容_CL21B225KAFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B225KAFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1214441.45 MB36页28
IC封装资料_电源管理芯片_MC33814AE.pdf
DocumentNumber:MC33814Rev.9.0,10/2016NXPSemiconductorsDatasheet:TechnicalData©2016NXPB.V.TwocylindersmallenginecontrolICPoweredby...
2024-12-121132.45 MB65页202
IC封装资料_电容_CL21B225KAFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B225KAFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-128261.46 MB36页250
IC封装资料_电容_CL21B225KPFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1214651.46 MB36页157
IC封装资料_电容_GRM155R71E123KA61D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12891920.26 KB29页79
IC封装资料_电容_GRM1885C1H9R1CA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comForapplicationsthatdonotrequir...
2024-12-1211514.37 MB90页183
IC封装资料_电容_CL10B123KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-126571.45 MB36页43
IC封装资料_电容_CL21B271KBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-12837.46 MB84页271
IC封装资料_电容_CL10B123KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121790361.49 KB3页226

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