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IC封装资料_电容_CL21C331JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213551.45 MB36页267
IC封装资料_电容_CL10B221KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12498259.57 KB3页266
IC封装资料_电容_CL21C330JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B472KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218241.45 MB36页235
IC封装资料_电容_0805F226M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215421.05 MB27页176
IC封装资料_连接器_1881642.pdf
https://www.phoenixcontact.com/pi/products/188164204/10/2019Page1/4Printed-circuitboardconnector-MCV0,5/11-G-2,5-1881642Pleasebein...
2024-12-121263200.84 KB4页240
IC封装资料_电感_YNR6045-102M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12754672.55 KB6页1
IC封装资料_连接器_1881639.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/10-G-2,5OrderNo.:18816...
2024-12-12637220.89 KB4页97
IC封装资料_电容_GRM1885C1H330GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121679944.07 KB30页61
IC封装资料_电源管理芯片_MP1498.pdf
MP1498High-Efficiency,2A,16V,1.4MHzSynchronous,Step-DownConverterMP1498Rev.1.01www.MonolithicPower.com112/18/2012MPSProprietaryInf...
2024-12-121165709.1 KB18页253
IC封装资料_电容_CL21C332JBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-122691.39 MB36页238
IC封装资料_电源管理芯片_MP1495S.pdf
MP1495SHighEfficiency3A,16V,500kHzSynchronousStep-DownConverterMP1495SRev.1.0www.MonolithicPower.com112/13/2013MPSProprietaryInfor...
2024-12-12617976.61 KB18页226
IC封装资料_连接器_1904969.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2011ExtractfromtheonlinecatalogZFKDS2,5-5,08OrderNo.:1904969...
2024-12-12557238.13 KB6页64
IC封装资料_电容_GRM155R71H222KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12956920.26 KB29页112
IC封装资料_连接器_1903815-1.pdf
A3DIMENSIONS:0PLC1PLC2PLC3PLC4PLCANGLESDDCBACBA4321OFSCALESHEETREVNAMESIZECAGECODEDRAWINGNOTOLERANCESUNLESSOTHERWISESPECIFIED:DWNC...
2024-12-121455295.8 KB1页43
IC封装资料_连接器_1888700.pdf
https://www.phoenixcontact.com/us/produkte/188870019.10.2012Page1/6PCBconnectionterminalblock-MKDSN2.5/4-5.08-1888700Pleasebeinfor...
2024-12-121776199.12 KB6页23
IC封装资料_电容_CL10B221KC85PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B221KC85PNC●Product:Multi-layerCeramicCapacitorCAP,220㎊,100V,±10%,X7R,0603●AEC-Q200Qual...
2024-12-125975.82 MB36页113
IC封装资料_连接器_1888690.pdf
https://www.phoenixcontact.com/us/produkte/188869021.12.2012Page1/6PCBterminalblock-MKDSN2.5/3-5.08-1888690Pleasebeinformedthatthe...
2024-12-12893198.32 KB6页228
IC封装资料_连接器_1888687.pdf
PHOENIXCONTACTInc.,USAPage1/6http://www.phoenixcon.comJan19,2011ExtractfromtheonlinecatalogMKDSN2,5/2-5,08OrderNo.:1888687http://e...
2024-12-121934250.3 KB6页217
IC封装资料_连接器_1881655.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/12-G-2,5OrderNo.:18816...
2024-12-121085220.99 KB4页40
IC封装资料_电容_GRM1885C1H331GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12987944.07 KB30页119

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