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IC封装资料_电容_GRM155R71H563KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12325920.26 KB29页211
IC封装资料_电容_GRM1885C1H820FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121960944.07 KB30页13
IC封装资料_电容_CL31B105KAHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B105KAHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-121361.45 MB36页42
IC封装资料_电容_CL10B223KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12722259.58 KB3页118
IC封装资料_电容_CL10B223KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12657259.58 KB3页161
IC封装资料_电容_CL31B104KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31F334ZBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-127691.45 MB36页228
IC封装资料_电容_0805N4R7C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210961.26 MB20页133
IC封装资料_连接器_A2541HWV-8P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121122814.66 KB16页298
IC封装资料_连接器_A2541HWV-7P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121067814.71 KB16页79
IC封装资料_电感_YNR8040-330M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121332666.38 KB5页164
IC封装资料_连接器_A2541HWV-6P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121530815.07 KB16页256
IC封装资料_电感_YNR8040-221M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12153666.38 KB5页33
IC封装资料_连接器_A2541HWV-5P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12578814.88 KB16页192
IC封装资料_电源管理芯片_MT2492.pdf
AEROSEMIMT2492AerosemiTechnologyCo.,Ltd1600KHz,16V，2ASynchronousStep-DownConverterFEATURESHighEfficiency:Upto96%600KHzFrequen...
2024-12-12634478.71 KB9页294
IC封装资料_电容_GRM1885C1H820GA01D.pdf
GRM1885C1H820GA01_(0603,C0G:EIA,82pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121751944.11 KB30页220
IC封装资料_电容_GRM155R71H681KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12364920.26 KB29页167
IC封装资料_电容_CL31B106KAHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B106KAHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123031.45 MB36页109
IC封装资料_电容_CL10B223KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12744452.9 KB21页158
IC封装资料_电容_CL31B105KCHNNNE.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12572452.9 KB21页120
IC封装资料_电容_0805N100J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-122551.26 MB20页72

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