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IC封装资料_电感_NLV32T-5R6J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-1285325.72 KB6页279
IC封装资料_电源管理芯片_LT3010EMS8E-5_TRPBF.pdf
LT3010/LT3010-5130105feFEATURESAPPLICATIONSDESCRIPTION50mA,3Vto80VLowDropoutMicropowerLinearRegulatorTheLT®3010isahighvoltage,mic...
2024-12-12722488.53 KB18页279
IC封装资料_电容_0603CG2R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12971.05 MB27页279
IC封装资料_连接器_1757569.pdf
PHOENIXCONTACTInc.,USAPage1/6http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/12-GOrderNo.:1757569Thefigures...
2024-12-121106231.25 KB6页279
IC封装资料_电源管理芯片_LTC3220EPF_TRPBF.pdf
LTC3220/LTC3220-1132201fdFormoreinformationwww.linear.com/LTC3220TypicalapplicaTionFeaTuresapplicaTionsDescripTion360mAUniversal18...
2024-12-121186357.1 KB20页279
IC封装资料_电感_SWPA6045S1R0NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122441.32 MB22页279
IC封装资料_电阻_MFR-25FTE52-1K.pdf
Through-holeresisTorsFeATuresPowerRating1/6W,1/4W,1/2W,1W,2W,3WResistanceTolerance±0.5%,±1%,±5%T.C.R.±15ppm/°C,±25ppm/°C,±...
2024-12-121708238.34 KB3页279
IC封装资料_电容_CL10C562JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12134316.41 KB3页279
IC封装资料_机械式继电器_G6KU-2F-Y.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
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IC封装资料_电容_0805CG240J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
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IC封装资料_电容_CL10B153JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B153JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121643360.63 KB3页279
IC封装资料_电容_GRM1885C1H302JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121049944.07 KB30页279
IC封装资料_电容_CL10B222KC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121088259.58 KB3页279
IC封装资料_电容_CL10B333KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12643259.58 KB3页279
IC封装资料_电容_1206B182K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216471.05 MB27页279
IC封装资料_电容_1206B271K500NT.pdf
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IC封装资料_连接器_DF12_3.0_-10DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12512288.67 KB11页279
IC封装资料_连接器_DF12D_4.0_-60DP-0.5V_81_.pdf
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2024-12-12562288.67 KB11页279
IC封装资料_连接器_DF13E-10DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
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IC封装资料_电感_YPRH0704-221M.pdf
SMDPowerInductors-YPRH0704Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121372730.34 KB5页279

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