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IC封装资料_电源管理芯片_LT1764AEFE_PBF.pdf
1LT1764ASeries1764afb3A,FastTransientResponse,LowNoise,LDORegulators■OptimizedforFastTransientResponse■OutputCurrent:3A■Dropout...
2024-12-12367703.4 KB20页298
IC封装资料_电容_0402CG240J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128481.05 MB27页298
IC封装资料_电容_0402F105M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210501.05 MB27页298
IC封装资料_电源管理芯片_LM3880MFE-1AA_NOPB.pdf
FLAG16EN5FLAG214FLAG3VCCPowerSupply2Enable3GND2EnableInputSupplyPowerSupply1EnablePowerSupply3EnableProductFolderOrderNowTechnical...
2024-12-129872.15 MB30页298
IC封装资料_电感_SDCL1608C10NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-12706376.19 KB4页298
IC封装资料_电感_SLF10145T-680M1R2-PF.pdf
INDUCTORSApril2016��SLF10145��SLF10145�SLF��更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20160411/in...
2024-12-121688353.89 KB9页298
IC封装资料_电容_GRM21BR61E106KA73L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12162410.43 MB296页298
IC封装资料_电容_GRM1555C1H8R2DA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12442920.26 KB29页298
IC封装资料_电源管理芯片_LTC4263CDE-1_TRPBF.pdf
LTC4263-1142631faTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONHighPowerSinglePSEControllerwithInternalSwitchTheLTC®4263-1isah...
2024-12-12246371.4 KB20页298
IC封装资料_电容_CL10C560JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12711259.58 KB3页298
IC封装资料_电容_CL10F104ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12563259.58 KB3页298
IC封装资料_电源管理芯片_LTC4415EMSE_TRPBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-121590435.08 KB20页298
IC封装资料_电容_CL10F334ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F334ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218481.42 MB36页298
IC封装资料_电容_0805CG3R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127931.05 MB27页298
IC封装资料_电容_GRM1885C1H270FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12822944.07 KB30页298
IC封装资料_连接器_A2541HWV-8P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121121814.66 KB16页298
IC封装资料_连接器_AFC01-S05FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-12641.85 MB10页298
IC封装资料_电容_GRM188F51H104ZA01D.pdf
GRM188F51H104ZA01_(0603,Y5V,0.1uF,50Vdc)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)4....
2024-12-12593846.35 KB29页298
IC封装资料_电容_CC0402KRX5R5BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219731.22 MB13页298
IC封装资料_连接器_AFC11-S08ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-128581.4 MB10页298

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