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IC封装资料_电容_CL21C331JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213551.45 MB36页267
IC封装资料_电源管理芯片_MIC5365-1.2YC5-TR.pdf
LP5951VINOUTGNDNCINEnableControl,activehigh13245LoadEN1�F1�FProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&Commu...
2024-12-1211261.31 MB27页267
IC封装资料_电容_GRM1885C1H112JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121820944.07 KB30页267
IC封装资料_电容_CL10Y104MR5NJNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y104MR5NJNCProduct:Multi-layerCeramicCapacitor...
2024-12-12202264.26 KB3页267
IC封装资料_电容_CL10C820JC81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C820JC81PNC●Product:Multi-layerCeramicCapacitorCAP,82㎊,100V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1218705.8 MB36页267
IC封装资料_电容_0805B562K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219771.26 MB20页267
IC封装资料_电容_GRM155R61C105KA12D.pdf
GRM155R61C105KA12_(0402,X5R:EIA,1uF,DC16V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12391920.85 KB29页267
IC封装资料_电容_C823D562J60Q350.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-124522.9 MB5页267
IC封装资料_连接器_1758115.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12110336.13 MB445页267
IC封装资料_电源管理芯片_LTC3864EDE_PBF.pdf
LTC386413864faFormoreinformationwww.linear.com/LTC3864TypicalapplicaTionFeaTuresDescripTion60VLowIQStep-DownDC/DCControllerwith100...
2024-12-12756771.71 KB30页267
IC封装资料_连接器_1731721.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogGMKDS3/2-7,62OrderNo.:1731721...
2024-12-12549224.35 KB6页267
IC封装资料_电容_0603CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123691.05 MB27页267
IC封装资料_电感_NLV32T-6R8J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121889224.35 KB10页267
IC封装资料_电源管理芯片_MP2143.pdf
MP21433A,5.5V,1.2MHz,40μAIQ,COTSynchronousStepDownSwitcherMP2143Rev.1.07www.MonolithicPower.com17/4/2016MPSProprietaryInformation...
2024-12-12908559.14 KB14页266
IC封装资料_电容_CL10B221KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12498259.57 KB3页266
IC封装资料_连接器_1881600.pdf
https://www.phoenixcontact.com/us/produkte/188160003.10.2012Page1/5Basestrip-MCV0.5/7-G-2.5-1881600Pleasebeinformedthatthedatashow...
2024-12-12838171.7 KB5页266
IC封装资料_电容_CC0402BRNPO9BNR80.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121893998.46 KB11页266
IC封装资料_电容_CL21A106KAYNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1219551.42 MB36页266
IC封装资料_电感_WPN252012H1R0MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121919624.92 KB9页266
IC封装资料_电容_0805CG2R7C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214121.05 MB27页266

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