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IC封装资料_电容_GRM155R71C273KA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1285910.43 MB296页263
IC封装资料_电容_CC0402CRNPO9BN2R7.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1279217.81 MB176页263
IC封装资料_电容_CC0402CRNPO9BN8R2.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210841.22 MB13页263
IC封装资料_电容_CL10B221KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B221KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219221.45 MB36页263
IC封装资料_连接器_A0801AWR-02-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12884334.91 KB1页263
IC封装资料_电容_GRM1885C1H911JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1278944.07 KB30页263
IC封装资料_电源管理芯片_NCR320ZX.pdf
NCR320Z/NCR321Z250mALEDdriverinSOT223Rev.1—4February2019Productdatasheet1.Productprofile1.1.GeneraldescriptionLEDdriverconsisting...
2024-12-121906539.95 KB18页263
IC封装资料_电容_GRM188R61H684KA75D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM188R61H684KA75_(0603,X5R(EIA),0.68uF,DC50V)_:PackagingCodeReferenceSheet■Scope...
2024-12-121952898.62 KB30页263
IC封装资料_电容_CL10B472KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12977259.58 KB3页263
IC封装资料_连接器_DF12C_3.0_-30DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12439288.67 KB11页263
IC封装资料_电容_T491B475K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1210651.54 MB23页263
IC封装资料_电容_TAJA685K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12117210.32 KB7页263
IC封装资料_电容_TAJB155M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12508210.32 KB7页263
IC封装资料_电容_TAJB157M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-1296210.32 KB7页263
IC封装资料_电容_TAJB157K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121404210.32 KB7页263
IC封装资料_电容_1808B471K302NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212871.05 MB27页263
IC封装资料_电容_GRM0335C1H470GA01.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
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IC封装资料_嵌入式微处理器_STC15W204S-35I-SOP16.pdf
STCMCULimitedSTC—8051单片机全球第一品牌，全球最大的8051单片机设计公司官方网站：www.STCMCU.comwww.GXWMCU.comSTC15F2K60S2系列单片机...
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IC封装资料_三极管_BCV47.pdf
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2024-12-1216292.03 MB4页263
IC封装资料_三极管_DMN2300UFD-7-81.pdf
DMN2300UFDDatasheetNumber:DS35443Rev.2-21of7www.diodes.comSeptember2011©DiodesIncorporatedAProductLineofDiodesIncorporatedDMN2300...
2024-12-121465361.96 KB7页263

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