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IC封装资料_电容_0603B221K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215131.05 MB27页262
IC封装资料_电容_0603B301K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126141.26 MB20页262
IC封装资料_电源管理芯片_LT1764EQ_TRPBF.pdf
1LT1764Series1764fb3A,FastTransientResponse,LowNoise,LDORegulators■OptimizedforFastTransientResponse■OutputCurrent:3A■DropoutVo...
2024-12-121174360.65 KB20页262
IC封装资料_电容_GJM1555C1H2R2CB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12108510.43 MB296页262
IC封装资料_电感_NLV32T-101J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121038325.74 KB6页262
IC封装资料_电容_CC1206KKX7R7BB106.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127221.22 MB13页262
IC封装资料_电感_SDCL1005C4N3STDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121711376.19 KB4页262
IC封装资料_电源管理芯片_LTC3407AEMSE-2_TRPBF.pdf
LTC3407A-213407a2f■HighEfficiency:Upto95%■LowRipple(<35mVPK-PK)BurstModeOperation;IQ=40μA■2.25MHzConstantFrequencyOperation■N...
2024-12-12840358.76 KB16页262
IC封装资料_电容_0805B272K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128011.05 MB27页262
IC封装资料_电容_GRM155R60J474KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121859920.26 KB29页262
IC封装资料_电容_GRM1555C1H270GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1283920.26 KB29页262
IC封装资料_电源管理芯片_LTM4627MPY_PBF.pdf
LTM462714627fcFormoreinformationwww.linear.com/LTM4627TYPICALAPPLICATIONDESCRIPTION15ADC/DCµModuleRegulatorTheLTM®4627isacomplet...
2024-12-12253651.21 KB32页262
IC封装资料_电源管理芯片_LTM8025EY_PBF.pdf
LTM80251Rev.DFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION36V,3AStep-DownµMod...
2024-12-124621.47 MB22页262
IC封装资料_电容_GRM1885C1H5R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1251944.07 KB30页262
IC封装资料_电源管理芯片_MCP73831T-2ATI_OT.pdf
2005-2014MicrochipTechnologyInc.DS20001984G-page1MCP73831/2Features:•LinearChargeManagementController:-IntegratedPassTransistor...
2024-12-12645915.61 KB28页262
IC封装资料_电容_GRM155R71E393KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121747920.26 KB29页262
IC封装资料_电容_CC0402JRNPO9BN300.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12129917.81 MB176页262
IC封装资料_电容_GRM188R60J106ME47J.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1225910.43 MB296页262
IC封装资料_电容_CL10B333JB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333JB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121475360.62 KB3页262
IC封装资料_电容_CL10B473KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121539452.9 KB21页262

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