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IC封装资料_电感_MLK1005S1N8ST000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121046209.31 KB10页261
IC封装资料_电感_MLK1005S12NHT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121550209.31 KB10页261
IC封装资料_电容_0603B272K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210631.05 MB27页261
IC封装资料_电感_NLCV32T-4R7M-EFRD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121776249.79 KB16页261
IC封装资料_电容_CC1206KRX7R9BB471.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12780998.46 KB11页261
IC封装资料_电容_CL10A225KO8N3NC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KO8N3NC·Product:Multi-layerCeramicCapacitor...
2024-12-123551.45 MB36页261
IC封装资料_电阻_MFR0W4F1001A50.pdf
PartNo.料号Type类型PowerRating功率70°CDimension(尺寸)(mm)DLd±0.05H±3NormalSize(正常尺寸)MFR0W8MF-121/8W1.9±0.33.3±0.30.4528MF...
2024-12-121361473.76 KB2页261
IC封装资料_电容_0805CG1R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121001.05 MB27页261
IC封装资料_电容_GRM1885C1H2R4CA01D.pdf
GRM1885C1H2R4CA01_(0603,C0G:EIA,2.4pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12828944.09 KB30页261
IC封装资料_电源管理芯片_MAX6071AAUT50+T.pdf
19-6355;Rev17;6/20GeneralDescriptionTheMAX6070/MAX6071offeraverylownoiseandlow-driftvoltagereferenceinasmall6-pinSOT23package.Thes...
2024-12-122266.31 MB26页261
IC封装资料_连接器_1759046.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-129136.13 MB445页261
IC封装资料_电容_0805F123M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126851.05 MB27页261
IC封装资料_电源管理芯片_MP3422GG-Z.pdf
MP34226.5A,600kHzHighEfficiency,SynchronousStep-UpConverterwithOutputDisconnectin2x2mmQFNPackageMP3422Rev.1.01www.MonolithicPower....
2024-12-1256538.16 KB16页261
IC封装资料_电容_GRM155R71H823KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12966920.26 KB29页261
IC封装资料_连接器_AFC01-S26H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-125291.58 MB1页261
IC封装资料_连接器_AFC11-S55ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1210141.4 MB10页261
IC封装资料_电容_R76UR32204030J.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comF3034_R76•9/19/20161Oneworld.OneKEMETB...
2024-12-1218592.62 MB25页261
IC封装资料_电容_CL10B471KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B471KB8WPNC●Product:Multi-layerCeramicCapacitorCAP,470㎊,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1217695.82 MB36页261
IC封装资料_连接器_DF12D_4.0_-40DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12260288.67 KB11页261
IC封装资料_电容_T55V227M6R3C0015.pdf
T55www.vishay.comVishayPolytechRevision:27-Jun-20191DocumentNumber:40174Fortechnicalquestions,contact:polytech@vishay.comTHISDOCUM...
2024-12-12304778.32 KB26页261

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